Wafer foundry: "Currently, UMC manufactures the substantial majority of our wafers..........we purchase wafers from multiple foundries including United Microelectronics Corporation (UMC), Toshiba Corporation (Toshiba), Seiko Epson Corporation (Seiko), Samsung Electronics Co., Ltd. and He Jian Technology (Suzhou) Co., Ltd........We extended our collaboration with our foundry suppliers in the development of 65-nm, 45-nm and 40-nm complementary metal oxide semiconductor (CMOS) manufacturing technology and we were the first company in the PLD industry to ship 65-nm and 45-nm high-volume FPGA devices."
Assembly and test: "We purchase most of our assembly and some of our testing services from Siliconware Precision Industries Ltd. in Taiwan, Amkor Technology, Inc. in Korea and the Philippines and STATS ChipPAC Ltd. in Singapore."
Distributor: "Avnet, Inc. distributes the substantial majority of our products worldwide."
Patent foundation: "As of March 28, 2009, we held more than 2,000 issued United States (U.S.) patents, which vary in duration, and over 750 pending U.S. patent applications relating to our proprietary technology."
Employees: "As of March 28, 2009, we had 3,145 employees compared to 3,415 as of the end of the prior fiscal year."
Showing posts with label UMC. Show all posts
Showing posts with label UMC. Show all posts
Thursday, June 4, 2009
Tuesday, March 31, 2009
Leadis Technology 10K
Customer concentration: "In 2008, our two largest customers, Samsung SDI Corporation and Rikei Corporation, a sales distributor in Japan, accounted for approximately 24% and 38% of our revenue, respectively."
Wafer foundry: "Our foundry suppliers fabricate our display driver products using a customized, high-voltage version of their mature and stable CMOS process technology with feature sizes of 0.15 micron and higher. Our LED and touch controller products are fabricated on mature CMOS processes. Our principal foundry suppliers are Seiko Epson in Japan, and Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Corporation and United Microelectronics Corporation in Taiwan, but we may use other foundry suppliers in the future. "
Assembly and test: "We currently rely primarily on Chipbond Technology Corporation, International Semiconductor Technology Ltd. and King Yuan Electronics Co., Ltd., each located in Taiwan, and Unisem Group in Malaysia, to assemble and test our products."
Patent foundation and sales: "As of March 15, 2009, we had twenty U.S patents applications pending and had been issued nine U.S. patents. These patent applications and issued patents cover our intellectual property contained in our LED drivers, power management and touch technology products. In January 2009, we sold our display driver business including a number of relevant patents. In February 2009, we sold assets relating to a development-stage power management product, including one issued patent. In March 2009, we sold assets related to our audio products, including a number of patents and pending patents."
Employees: "As of December 31, 2008, we had 161 employees, including 100 in research and development, 23 in operations and 38 in sales, marketing, general and administrative functions. By region, 59 of our employees were located in the United States, 69 in Korea and 33 in Asia and Europe. At the end of 2007, we had 184 employees. Through sales of portions of our business and related transfers of headcount, as well as staff reductions enacted to reduce operating expenses, our headcount declined to 89 as of March 14, 2009."
Business sales: "In January 2009, we sold our display driver assets and transferred certain employees to AsTEK, Inc., a privately-held company located in Korea whose principal is the former general manager of our Korean R&D operation. The total consideration was $3.5 million in the form of a receivable due no later than January 2010 plus $0.5 million of assumed liabilities. We retained rights to most of the current display driver products in production, as well as ownership of our proprietary EpiC™ technology for AM-OLED displays. As a result of this transaction, we have ceased investment in the production, marketing and sale of new display driver integrated circuits.
In February 2009, we sold assets relating to a development-stage power management product. We sold these assets and transferred certain employees to a publicly-traded supplier of analog and mixed-signal semiconductor products. Under the terms of the sale, we will be paid $2.3 million in cash, of which $2 million has been received to date. As a result of this transaction, we ceased development of power management integrated circuits.
In March 2009, we sold assets related to our audio products and transferred certain employees to a publicly-traded supplier of semiconductor products. Under the terms of the sale, we were paid $1.45 million in cash, all of which has been received."
Wafer foundry: "Our foundry suppliers fabricate our display driver products using a customized, high-voltage version of their mature and stable CMOS process technology with feature sizes of 0.15 micron and higher. Our LED and touch controller products are fabricated on mature CMOS processes. Our principal foundry suppliers are Seiko Epson in Japan, and Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Corporation and United Microelectronics Corporation in Taiwan, but we may use other foundry suppliers in the future. "
Assembly and test: "We currently rely primarily on Chipbond Technology Corporation, International Semiconductor Technology Ltd. and King Yuan Electronics Co., Ltd., each located in Taiwan, and Unisem Group in Malaysia, to assemble and test our products."
Patent foundation and sales: "As of March 15, 2009, we had twenty U.S patents applications pending and had been issued nine U.S. patents. These patent applications and issued patents cover our intellectual property contained in our LED drivers, power management and touch technology products. In January 2009, we sold our display driver business including a number of relevant patents. In February 2009, we sold assets relating to a development-stage power management product, including one issued patent. In March 2009, we sold assets related to our audio products, including a number of patents and pending patents."
Employees: "As of December 31, 2008, we had 161 employees, including 100 in research and development, 23 in operations and 38 in sales, marketing, general and administrative functions. By region, 59 of our employees were located in the United States, 69 in Korea and 33 in Asia and Europe. At the end of 2007, we had 184 employees. Through sales of portions of our business and related transfers of headcount, as well as staff reductions enacted to reduce operating expenses, our headcount declined to 89 as of March 14, 2009."
Business sales: "In January 2009, we sold our display driver assets and transferred certain employees to AsTEK, Inc., a privately-held company located in Korea whose principal is the former general manager of our Korean R&D operation. The total consideration was $3.5 million in the form of a receivable due no later than January 2010 plus $0.5 million of assumed liabilities. We retained rights to most of the current display driver products in production, as well as ownership of our proprietary EpiC™ technology for AM-OLED displays. As a result of this transaction, we have ceased investment in the production, marketing and sale of new display driver integrated circuits.
In February 2009, we sold assets relating to a development-stage power management product. We sold these assets and transferred certain employees to a publicly-traded supplier of analog and mixed-signal semiconductor products. Under the terms of the sale, we will be paid $2.3 million in cash, of which $2 million has been received to date. As a result of this transaction, we ceased development of power management integrated circuits.
In March 2009, we sold assets related to our audio products and transferred certain employees to a publicly-traded supplier of semiconductor products. Under the terms of the sale, we were paid $1.45 million in cash, all of which has been received."
Friday, March 20, 2009
Actel 10K
Wafer foundry and geometries:
Patent foundation: "As of February 25, 2009, we held more than 390 United States patents and had applications pending for approximately 120 additional United States patents. We also held more than 100 foreign patents and had applications pending for more than 90 patents outside the United States."
Employees: "At the end of 2008, we had 550 full-time employees, including 142 in marketing, sales, and customer support; 226 in engineering and research and development; 143 in operations; and 39 in administration and finance. This compares with 584 full-time employees at the end of 2007, a decrease of 6%."
- "Chartered in Singapore using 0.45- and 0.35-micron design rules
- Infineon in Germany using 0.25- and 0.13-micron design rules
- Panasonic (formerly Matsushita) in Japan using 1.0-, 0.9-, 0.8- and 0.25-micron design rules
- UMC in Taiwan using 0.25/0.22-, 0.15-, and 0.13-micron and 65nm design rules
- Winbond in Taiwan using 0.8- and 0.45-micron design rules
Patent foundation: "As of February 25, 2009, we held more than 390 United States patents and had applications pending for approximately 120 additional United States patents. We also held more than 100 foreign patents and had applications pending for more than 90 patents outside the United States."
Employees: "At the end of 2008, we had 550 full-time employees, including 142 in marketing, sales, and customer support; 226 in engineering and research and development; 143 in operations; and 39 in administration and finance. This compares with 584 full-time employees at the end of 2007, a decrease of 6%."
Saturday, March 14, 2009
Lattice 10K
Wafer foundry: "We source silicon wafers from our foundry partners, Fujitsu in Japan, Seiko Epson Corporation (“Seiko Epson”) in Japan, United Microelectronics Corporation (“UMC”) in Taiwan and Chartered Semiconductor Manufacturing, Ltd. (“Chartered Semiconductor”) in Singapore, pursuant to agreements with each company and their respective affiliates."
Employees: "At January 3, 2009, we had 753 full-time employees."
Employees: "At January 3, 2009, we had 753 full-time employees."
Intellon 10K
Revenue model: "Although we commenced operations in 1989, we recently have experienced a period of significant growth and expansion. Our revenue grew to $75.4 million for 2008 from $52.3 million for 2007. In addition, our operating expenses increased to $32.3 million for 2008 from $31.5 million for 2007. ......... As of December 31, 2008, we had shipped more than 33.8 million powerline communications ICs, including 26.0 million HomePlug-based ICs that have been integrated into adapters, set-top boxes and other commercial applications. We shipped over 11.9 million powerline communication ICs in 2008, a 55% increase over shipments of more than 7.7 million powerline communications ICs in 2007. Our HomePlug-based ICs represented approximately 96% of our revenue for the year ended December 31, 2008"
Customer concentration: "Our ICs are currently incorporated into products by over 50 OEMs, including devolo AG, Aztech Systems Ltd., NETGEAR Inc., LEA S.A.S., and H3C Technologies Co. Limited and used by more than 45 service providers, including Free, Dish Network, France Telecom SA, Telecom Italia and AT&T. In 2008, Free, a service provider, devolo AG, an OEM, and Lumax International Corporation, a distributor, accounted for approximately 21%, 19% and 10% of our revenue, respectively."
Wafer foundry: "We currently use two wafer foundry companies for our ICs. For our HomePlug-based ICs, we use United Microelectronics Corporation in Taiwan and Chartered Semiconductor Manufacturing, Ltd in Singapore. We have in production HomePlug-based ICs using 65 nanometer, 90 nanometer, 150 nanometer and 180 nanometer process geometries for wafer production. We also use Chartered Semiconductor Manufacturing, Ltd. and On Semiconductor in the U.S. for our command and control ICs, using 0.5 micron and 1.5 micron processes, respectively. We use complementary metal oxide semiconductor (CMOS) manufacturing process technology for our ICs."
Assembly and test: "The assembly and testing of our products are performed by multiple principal subcontractors, which are Orient Semiconductor Electronics Ltd. (OSE) in Taiwan, Signetics in the Republic of Korea, Integra Technologies LLC in the U.S., ON Semiconductor in the Philippines and Advanced Semiconductor Engineering, Inc. in Taiwan. "
Employees: "As of December 31, 2008, we employed 128 full-time employees, including 64 in research and development, 35 in sales and marketing, 8 in operations and 21 in general and administration."
Customer concentration: "Our ICs are currently incorporated into products by over 50 OEMs, including devolo AG, Aztech Systems Ltd., NETGEAR Inc., LEA S.A.S., and H3C Technologies Co. Limited and used by more than 45 service providers, including Free, Dish Network, France Telecom SA, Telecom Italia and AT&T. In 2008, Free, a service provider, devolo AG, an OEM, and Lumax International Corporation, a distributor, accounted for approximately 21%, 19% and 10% of our revenue, respectively."
Wafer foundry: "We currently use two wafer foundry companies for our ICs. For our HomePlug-based ICs, we use United Microelectronics Corporation in Taiwan and Chartered Semiconductor Manufacturing, Ltd in Singapore. We have in production HomePlug-based ICs using 65 nanometer, 90 nanometer, 150 nanometer and 180 nanometer process geometries for wafer production. We also use Chartered Semiconductor Manufacturing, Ltd. and On Semiconductor in the U.S. for our command and control ICs, using 0.5 micron and 1.5 micron processes, respectively. We use complementary metal oxide semiconductor (CMOS) manufacturing process technology for our ICs."
Assembly and test: "The assembly and testing of our products are performed by multiple principal subcontractors, which are Orient Semiconductor Electronics Ltd. (OSE) in Taiwan, Signetics in the Republic of Korea, Integra Technologies LLC in the U.S., ON Semiconductor in the Philippines and Advanced Semiconductor Engineering, Inc. in Taiwan. "
Employees: "As of December 31, 2008, we employed 128 full-time employees, including 64 in research and development, 35 in sales and marketing, 8 in operations and 21 in general and administration."
Friday, March 13, 2009
Nvidia 10K
Graphics processor market share: "Our share of the standalone desktop GPU category decreased from 64% to 63% in fiscal year 2009, according to the December 2007 and December 2008 PC Graphics Report from Mercury Research, respectively. Our share of the standalone notebook category decreased from 75% to 63%, according to the December 2007 and December 2008 PC Graphics Report from Mercury Research, respectively."
Gross margin collapse: "During the fourth quarter of fiscal year 2009, our gross margin declined to 29.4% as compared to 45.7% during the fourth quarter of fiscal year 2008 and decreased from 41.0% from the third quarter of fiscal year 2009."
Microsoft stock rights: "On March 5, 2000, we entered into an agreement with Microsoft in which we agreed to develop and sell graphics chips and to license certain technology to Microsoft and its licensees for use in the Xbox. Under the agreement, if an individual or corporation makes an offer to purchase shares equal to or greater than 30% of the outstanding shares of our common stock, Microsoft may have first and last rights of refusal to purchase the stock. The Microsoft provision and the other factors listed above could also delay or prevent a change in control of NVIDIA."
Recent legal activity: "On February 17, 2009, Intel Corporation filed suit against NVIDIA Corporation, seeking declaratory and injunctive relief relating to a licensing agreement that the parties signed in 2004. The lawsuit was filed in Delaware Chancery Court. Intel seeks an order from the Court declaring that the license does not extend to certain future NVIDIA chipset products, and enjoining NVIDIA from stating that it has licensing rights for these products. The lawsuit seeks no damages from NVIDIA. If Intel successfully obtains such a court order, we could be unable to sell our MCP products for use with Intel processors and our competitive position would be harmed. NVIDIA’s response to the Intel complaint is currently due on March 23, 2009." (Nvidia's cases are far too numerous to detail here, but include landlord and trustee actions relating to 3dfx's bankruptcy, SEC cases, DOJ anti-trust cases, Rambus patent infringement claims and product liability claims resulting from product reliability issues.)
Customer concentration: "Sales to our largest customer, Hewlett-Packard Company, accounted for 11% of our total revenue for fiscal year 2009."
Foundry, assembly and test: "We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Corporation, or TSMC, United Microelectronics Corporation, or UMC, Chartered Semiconductor Manufacturing, or Chartered, Semiconductor Manufacturing International Corporation, or SMIC, and Austria Micro Systems, or AMS to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, or ASE, Amkor Technology, or Amkor, JSI Logistics Ltd., or JSI, King Yuan Electronics Co., Ltd, or KYEC, Siliconware Precision Industries Company Ltd., or SPIL, and STATS ChipPAC Incorporated, or ChipPAC, to perform assembly, testing and packaging of most of our products.......Our current product families are manufactured using 0.15 micron, 0.14 micron, 0.13 micron, 0.11 micron, 90 nanometer, 65 nanometer and 55 nanometer process technologies."
Packaging reliability problem: ".....For example, in July 2008, we recorded a $196.0 million charge against cost of revenue to cover anticipated customer warranty, repair, return, replacement and other associated costs arising from a weak die/packaging material set in certain versions of our previous generation MCP and GPU products used in notebook systems."
Employees: "As of January 25, 2009 we had 5,420 employees, 3,772 of whom were engaged in research and development and 1,648 of whom were engaged in sales, marketing, operations and administrative positions."
Gross margin collapse: "During the fourth quarter of fiscal year 2009, our gross margin declined to 29.4% as compared to 45.7% during the fourth quarter of fiscal year 2008 and decreased from 41.0% from the third quarter of fiscal year 2009."
Microsoft stock rights: "On March 5, 2000, we entered into an agreement with Microsoft in which we agreed to develop and sell graphics chips and to license certain technology to Microsoft and its licensees for use in the Xbox. Under the agreement, if an individual or corporation makes an offer to purchase shares equal to or greater than 30% of the outstanding shares of our common stock, Microsoft may have first and last rights of refusal to purchase the stock. The Microsoft provision and the other factors listed above could also delay or prevent a change in control of NVIDIA."
Recent legal activity: "On February 17, 2009, Intel Corporation filed suit against NVIDIA Corporation, seeking declaratory and injunctive relief relating to a licensing agreement that the parties signed in 2004. The lawsuit was filed in Delaware Chancery Court. Intel seeks an order from the Court declaring that the license does not extend to certain future NVIDIA chipset products, and enjoining NVIDIA from stating that it has licensing rights for these products. The lawsuit seeks no damages from NVIDIA. If Intel successfully obtains such a court order, we could be unable to sell our MCP products for use with Intel processors and our competitive position would be harmed. NVIDIA’s response to the Intel complaint is currently due on March 23, 2009." (Nvidia's cases are far too numerous to detail here, but include landlord and trustee actions relating to 3dfx's bankruptcy, SEC cases, DOJ anti-trust cases, Rambus patent infringement claims and product liability claims resulting from product reliability issues.)
Customer concentration: "Sales to our largest customer, Hewlett-Packard Company, accounted for 11% of our total revenue for fiscal year 2009."
Foundry, assembly and test: "We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Corporation, or TSMC, United Microelectronics Corporation, or UMC, Chartered Semiconductor Manufacturing, or Chartered, Semiconductor Manufacturing International Corporation, or SMIC, and Austria Micro Systems, or AMS to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, or ASE, Amkor Technology, or Amkor, JSI Logistics Ltd., or JSI, King Yuan Electronics Co., Ltd, or KYEC, Siliconware Precision Industries Company Ltd., or SPIL, and STATS ChipPAC Incorporated, or ChipPAC, to perform assembly, testing and packaging of most of our products.......Our current product families are manufactured using 0.15 micron, 0.14 micron, 0.13 micron, 0.11 micron, 90 nanometer, 65 nanometer and 55 nanometer process technologies."
Packaging reliability problem: ".....For example, in July 2008, we recorded a $196.0 million charge against cost of revenue to cover anticipated customer warranty, repair, return, replacement and other associated costs arising from a weak die/packaging material set in certain versions of our previous generation MCP and GPU products used in notebook systems."
Employees: "As of January 25, 2009 we had 5,420 employees, 3,772 of whom were engaged in research and development and 1,648 of whom were engaged in sales, marketing, operations and administrative positions."
Friday, March 6, 2009
PLX Technology 10K
Wafer foundy, assembly and test: "Currently, our products are primarily being fabricated, assembled or tested by AMD, Advanced Semiconductor Engineering, Fujitsu, FST, NEC, Seiko-Epson Semiconductor, STATS ChipPAC Ltd., Taiwan Semiconductor Manufacturing Corporation and UMC."
Employees: "As of December 31, 2008, we employed a total of 158 full-time employees, including 71 engaged in research and development, 57 engaged in sales and marketing, 3 engaged in manufacturing operations and 27 engaged in general administration activities."
Oxford acquisition: "On December 15, 2008, we signed a definitive agreement to acquire all of the outstanding shares of capital stock of Oxford, a privately held fabless provider of industry-leading silicon and software for the SOHO storage markets. The acquisition closed on January 2, 2009.........As a part of the Merger Agreement, the Company acquired all of the outstanding shares of capital stock of Oxford in exchange for 5,600,000 shares of common stock of PLX and a promissory note in the principal amount of $14,200,000 (the “Note”) that will be satisfied by either (i) the issuance of an additional 3,400,000 shares of common stock of PLX upon approval of PLX’s stockholders, or (ii) the repayment of the principal amount of the Note if such stockholder approval is not obtained by June 30, 2009.........The Company had a layoff in the first quarter of 2009 in connection with the acquisition of Oxford. The estimated severance cost is approximately $2.0 million."
Employees: "As of December 31, 2008, we employed a total of 158 full-time employees, including 71 engaged in research and development, 57 engaged in sales and marketing, 3 engaged in manufacturing operations and 27 engaged in general administration activities."
Oxford acquisition: "On December 15, 2008, we signed a definitive agreement to acquire all of the outstanding shares of capital stock of Oxford, a privately held fabless provider of industry-leading silicon and software for the SOHO storage markets. The acquisition closed on January 2, 2009.........As a part of the Merger Agreement, the Company acquired all of the outstanding shares of capital stock of Oxford in exchange for 5,600,000 shares of common stock of PLX and a promissory note in the principal amount of $14,200,000 (the “Note”) that will be satisfied by either (i) the issuance of an additional 3,400,000 shares of common stock of PLX upon approval of PLX’s stockholders, or (ii) the repayment of the principal amount of the Note if such stockholder approval is not obtained by June 30, 2009.........The Company had a layoff in the first quarter of 2009 in connection with the acquisition of Oxford. The estimated severance cost is approximately $2.0 million."
Wednesday, March 4, 2009
Gennum Annual Form (Toronto Stock Exchange)
Customers: "Our top OEM customers for our financial year ended November 30, 2008 were as Avago Technologies, Inc., Cisco Systems, Inc., Evertz Microsystems Ltd., Finisar Corporation, Harris Corporation, JDS Uniphase Corporation, Panasonic Corporation, SONY Corporation, Sumitomo Corporation and Thomson S.A. Our sales to these customers accounted for a total of approximately 39% of our net revenues for our financial year ended November 30, 2008."
Sales by Product Group (US$):
Employees: "At the end of the financial year of the Corporation ended November 30, 2008, we employed 429 people in our operations. The functional breakdown of our employees is as follows:
Sales by Product Group (US$):
- Analog & Mixed-Signal: $97.9M, 77.1%
- Optical: $17.6M, 13.9%
- IP Licensing: $11.4M, 9.0%
Employees: "At the end of the financial year of the Corporation ended November 30, 2008, we employed 429 people in our operations. The functional breakdown of our employees is as follows:
- Administrative: 82
- Research & Development: 168
- Operations: 90
- Marketing & Sales: 64"
Subscribe to:
Posts (Atom)