Rambus 10Q

Increasing customer concentration: "Five customers accounted for 26%, 15%, 14%, 13% and 12%, respectively, of revenue in the three months ended June 30, 2009.........We have a high degree of revenue concentration, with our top five licensees representing approximately 79% and 78% of our revenue for the three and six months ended June 30, 2009, respectively. This compares with the three and six months ended June 30, 2008, in which revenue from our top five licensees accounted for approximately 69% and 68% of our revenue, respectively. For the three months ended June 30, 2009, revenue from Fujitsu, Sony, AMD, Toshiba and NEC each accounted for 10% or more of our total revenue. For the six months ended June 30, 2009, revenue from Fujitsu, NEC, AMD, Sony and Panasonic each accounted for 10% or more of our total revenue."

Patent foundation: "As of June 30, 2009, our chip interface technologies are covered by more than 810 U.S. and foreign patents. Additionally, we have approximately 560 patent applications pending."

Actel 10K

Wafer foundry and geometries:

• "Chartered in Singapore using 0.45- and 0.35-micron design rules
• Infineon in Germany using 0.25- and 0.13-micron design rules
• Panasonic (formerly Matsushita) in Japan using 1.0-, 0.9-, 0.8- and 0.25-micron design rules
• UMC in Taiwan using 0.25/0.22-, 0.15-, and 0.13-micron and 65nm design rules
• Winbond in Taiwan using 0.8- and 0.45-micron design rules

In November 2008, UMC and Actel jointly announced that the two companies have collaborated in the production of Actel’s next generation Flash-based FPGAs. The chips will be manufactured on UMC’s 65nm low leakage process, and will take advantage of the foundry’s 65nm embedded Flash (“eFlash”) technology."

Patent foundation: "As of February 25, 2009, we held more than 390 United States patents and had applications pending for approximately 120 additional United States patents. We also held more than 100 foreign patents and had applications pending for more than 90 patents outside the United States."

Employees: "At the end of 2008, we had 550 full-time employees, including 142 in marketing, sales, and customer support; 226 in engineering and research and development; 143 in operations; and 39 in administration and finance. This compares with 584 full-time employees at the end of 2007, a decrease of 6%."

Gennum Annual Form (Toronto Stock Exchange)

Customers: "Our top OEM customers for our financial year ended November 30, 2008 were as Avago Technologies, Inc., Cisco Systems, Inc., Evertz Microsystems Ltd., Finisar Corporation, Harris Corporation, JDS Uniphase Corporation, Panasonic Corporation, SONY Corporation, Sumitomo Corporation and Thomson S.A. Our sales to these customers accounted for a total of approximately 39% of our net revenues for our financial year ended November 30, 2008."

Sales by Product Group (US$):

• Analog & Mixed-Signal: $97.9M, 77.1%
  
• Optical: $17.6M, 13.9%
  
• IP Licensing: $11.4M, 9.0%

Wafer Foundries: "We are a “fabless” semiconductor company, and outsource wafer fabrication for our products to third-party silicon wafer foundries such as United Manufacturing Corporation ("UMC"), STMicroelectronics and Tower Semiconductor Ltd. (Jazz)."

Employees: "At the end of the financial year of the Corporation ended November 30, 2008, we employed 429 people in our operations. The functional breakdown of our employees is as follows:

• Administrative: 82
• Research & Development: 168
• Operations: 90
• Marketing & Sales: 64"

(No explanation as to why the totals don't match)

Microtune 10K

Employees: As of December 31, 2008, we had a total of 220 employees worldwide, including 147 in research and development, 37 in sales and marketing and 36 in operations, finance and administration. Of these employees, 141 were located in the United States.

Top Customers: Cisco (Cable) = 29%, Unihan (subsidiary of Asustek serving ARRIS) = 13%, Panasonic (Cable and Automotive) = 12%

Wafer Foundry and processes: "........IBM, Jazz Semiconductor (a Tower Group Company) and X-FAB, to help ensure our future demands are in line with their manufacturing technology roadmaps and capacities. These foundries offer a mature BiCMOS production process. In addition, IBM and Jazz Semiconductor offer advanced silicon germanium (SiGe) process technology.

Assembly, probe and test: We use Amkor in South Korea and in the Philippines and ASE in South Korea for IC packaging and final test. We use Criteria Labs in Austin, Texas for wafer probe and in Penrose, Colorado for tape and reel packaging. We also use ISE in Austin, Texas for wafer probe. We also perform RF testing at our facility in Plano, Texas.