SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--IDT® (Integrated Device Technology, Inc.) (NASDAQ:IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience and Taiwan Semiconductor Manufacturing Company (TWSE:2330) (NYSE:TSM), today announced they have entered into an agreement to transfer product fabrication processes and related activities currently running in the IDT Hillsboro, Oregon facility to TSMC foundries. The transfer, which has already received approval by both companies and the IDT Board of Directors, is expected to take up to two years to complete and will cover the lifecycle of all products involved.
“Over the past year or so, IDT has been shifting gears towards developing application specific solutions for the communications, computing and consumer markets. Obtaining an agreement with TSMC enables us to take full advantage of their cutting edge manufacturing processes and geometries and is the logical next step in our transformation,” said Mike Hunter, vice president of worldwide manufacturing for IDT. “This agreement, which will combine IDT system expertise and architecture and the TSMC technology platform, expands our overall global manufacturing capability. It also officially starts the countdown for IDT to move from a Fab-lite to a Fab-less model.”
IDT product processes and geometries transferred under this agreement include existing IDT products currently manufactured at the Fab 4 facility in Hillsboro, Oregon at .13 micron process technology and above. These processes and products will be transferred to TSMC over the ensuing two years. The agreement does not include transfer or sale of the process equipment or the IDT facility located in Hillsboro, Oregon. IDT intends to exit the Hillsboro, Oregon wafer fabrication facility at the end of the transfer period and has engaged a third party to market the facility to potential buyers that can continue fabrication operations.
Additional Details from 8K Filing: "On August 3, 2009, in connection with the plan to transition the manufacture of products to TSMC, the Company’s management, with prior approval of the Board of Directors, approved a plan to exit wafer production operations at its Oregon fabrication facility. If unsuccessful in its efforts to sell the Oregon facility to a buyer that can continue fabrication operations, the Company estimates it will incur total charges of approximately $15 million to $25 million to exit the facility. These aggregate exit costs are expected to consist primarily of expenses related to employee severance, retention, and post-employment benefits, and expenses associated with the decommissioning of equipment and the facility. The Company estimates it will incur costs of approximately $10 million in severance, retention, and post-employment benefits, of which approximately $4 million to $6 million is expected to be recorded in the second quarter of fiscal 2010. Costs of approximately $5 million to $15 million associated with closure activities related to decommissioning of equipment and the facility are expected to be recorded in future periods as incurred. Substantially all of the exit costs are expected to result in cash expenditures."
Showing posts with label TSMC. Show all posts
Showing posts with label TSMC. Show all posts
Thursday, August 6, 2009
Thursday, July 30, 2009
TSMC 6K
Process geometries run in Q2 (note these are revenue not wafer volume): "Advanced process technologies (0.13-micron and below) accounted for 65% of wafer revenues. 90-nanometer process technology accounted for 23% of wafer revenues, 65-nanometer 28%, and 45/40-nanometer, with wafer shipments tripling those of 1Q, exceeded 1% of total wafer sales."
Thursday, July 16, 2009
Spreadtrum Communications 20F
Wafer foundries and process geometries: "All of our current semiconductors are developed and manufactured with 0.18-micron, 0.16-micron, 0.152-micron, 90-nanometer and 65-nanometer CMOS process technology. We have outsourced all of our wafer production to foundries, most of which has been outsourced to TSMC, the world’s largest foundry and our primary foundry service provider since our inception."
Assembly and test: "We have developed our own automatic testing program for semiconductors and outsource all of our assembly and testing requirements to ASE, SPIL and other sub-contractors."
Employees: "As of December 31, 2008, our workforce consisted of 674 employees, of which 639 were located in China and 35 were located in the United States. Of our employees, 55 were in sales and marketing, 74 were in general and administration, 519 were in research and development and 26 were in operations and procurement and information technology."
Patent foundation: "As of May 31, 2009, we owned 45 patents and had 375 pending patent applications in China, we owned 23 patents and had 29 pending patent applications in the United States and we had 11 pending patent applications in Europe and 5 pending PCT patent applications. We also acquired co-ownership of 20 patents and 10 pending patent applications in China. Our issued patents and pending patent applications relate primarily to technology we developed for our baseband semiconductors, including TD-SCDMA, HSDPA, HSUPA, WCDMA and GSM/GPRS technologies, and radio frequency transceivers."
Assembly and test: "We have developed our own automatic testing program for semiconductors and outsource all of our assembly and testing requirements to ASE, SPIL and other sub-contractors."
Employees: "As of December 31, 2008, our workforce consisted of 674 employees, of which 639 were located in China and 35 were located in the United States. Of our employees, 55 were in sales and marketing, 74 were in general and administration, 519 were in research and development and 26 were in operations and procurement and information technology."
Patent foundation: "As of May 31, 2009, we owned 45 patents and had 375 pending patent applications in China, we owned 23 patents and had 29 pending patent applications in the United States and we had 11 pending patent applications in Europe and 5 pending PCT patent applications. We also acquired co-ownership of 20 patents and 10 pending patent applications in China. Our issued patents and pending patent applications relate primarily to technology we developed for our baseband semiconductors, including TD-SCDMA, HSDPA, HSUPA, WCDMA and GSM/GPRS technologies, and radio frequency transceivers."
Omnivision Technologies 10K
Customer concentration: "The one OEM customer that accounted for 10% or more of our revenues in fiscal 2009 was Foxconn Technology Group, or Foxconn, which accounted for approximately 10.4% of our revenues. The one distributor that accounted for 10.0% or more of our revenues in fiscal 2009 was World Peace Industrial Group or World Peace, which accounted for approximately 22.4% of our revenues."
Wafer foundries and geometries: "We outsource our wafer manufacturing for image sensors to TSMC and PSC. Our image sensor products are currently fabricated using a standard process at 0.11 µm, 0.13 µm, 0.18 µm, 0.25 µm, 0.50 µm and 0.60 µm. In addition, TSMC fabricates our companion DSP and interface chips."
Packaging and test: "For a portion of our product lines, we rely on Siliconware Precision Industries Co., Ltd. and ImPac Technology Co., Ltd., or ImPac, an investee company, for substantially all of our ceramic chip packaging. We rely on XinTec, and China Wafer Level Chip Scale Packaging, or WLCSP, two other investee companies, for our CSP products, which are generally designed for the smallest form factor applications. Wafers that are designated for chip-on-board, or COB, packaging are tested using a process called wafer probe testing. We outsource wafer probe testing to King Yuan Electronics Co., Ltd., STATS ChipPAC Taiwan Semiconductor Corp. and VisEra."
Employees: "As of April 30, 2009, we had a total of 416 full-time employees engaged in research and development."
Patent foundation: "As of April 30, 2009, we have been issued 98 United States patents which expire between October 2015 and August 2026. We have also received 150 foreign patents which expire between April 2016 and December 2027. As of April 30, 2009, we have 132 additional United States patent applications pending, of which two have been allowed, and we have 243 foreign patent applications pending, of which 19 have been allowed."
Recent litigation: "On March 6, 2009, Panavision Imaging, LLC, or Panavision, filed a complaint against us alleging patent infringement in the District Court for the Central District of California. The case is entitled Panavision Imaging, LLC v. OmniVision Technologies, Inc., Canon U.S.A., Inc., Micron Technology, Inc. and Aptina Imaging Corporation, Case No. CV09-1577. In its complaint, Panavision asserts that we make, have made, use, sell and/or import products that infringe U.S. Patent Nos. 6,818,877 ("Pre-charging a Wide Analog Bus for CMOS Image Sensors"), 6,663,029 ("Video Bus for High Speed Multi-resolution Imagers and Method Thereof") and 7,057,150 ("Solid State Imager with Reduced Number of Transistors per Pixel"). The complaint seeks unspecified monetary damages, fees and expenses and injunctive relief against us. We are in the initial stages of reviewing and investigating the complaint and expect to vigorously defend ourselves against Panavision's allegations. The Court has scheduled a claim construction hearing for December 10, 2009. At this time, we cannot estimate any possible loss or predict whether this matter will result in any material expense to us."
Wafer foundries and geometries: "We outsource our wafer manufacturing for image sensors to TSMC and PSC. Our image sensor products are currently fabricated using a standard process at 0.11 µm, 0.13 µm, 0.18 µm, 0.25 µm, 0.50 µm and 0.60 µm. In addition, TSMC fabricates our companion DSP and interface chips."
Packaging and test: "For a portion of our product lines, we rely on Siliconware Precision Industries Co., Ltd. and ImPac Technology Co., Ltd., or ImPac, an investee company, for substantially all of our ceramic chip packaging. We rely on XinTec, and China Wafer Level Chip Scale Packaging, or WLCSP, two other investee companies, for our CSP products, which are generally designed for the smallest form factor applications. Wafers that are designated for chip-on-board, or COB, packaging are tested using a process called wafer probe testing. We outsource wafer probe testing to King Yuan Electronics Co., Ltd., STATS ChipPAC Taiwan Semiconductor Corp. and VisEra."
Employees: "As of April 30, 2009, we had a total of 416 full-time employees engaged in research and development."
Patent foundation: "As of April 30, 2009, we have been issued 98 United States patents which expire between October 2015 and August 2026. We have also received 150 foreign patents which expire between April 2016 and December 2027. As of April 30, 2009, we have 132 additional United States patent applications pending, of which two have been allowed, and we have 243 foreign patent applications pending, of which 19 have been allowed."
Recent litigation: "On March 6, 2009, Panavision Imaging, LLC, or Panavision, filed a complaint against us alleging patent infringement in the District Court for the Central District of California. The case is entitled Panavision Imaging, LLC v. OmniVision Technologies, Inc., Canon U.S.A., Inc., Micron Technology, Inc. and Aptina Imaging Corporation, Case No. CV09-1577. In its complaint, Panavision asserts that we make, have made, use, sell and/or import products that infringe U.S. Patent Nos. 6,818,877 ("Pre-charging a Wide Analog Bus for CMOS Image Sensors"), 6,663,029 ("Video Bus for High Speed Multi-resolution Imagers and Method Thereof") and 7,057,150 ("Solid State Imager with Reduced Number of Transistors per Pixel"). The complaint seeks unspecified monetary damages, fees and expenses and injunctive relief against us. We are in the initial stages of reviewing and investigating the complaint and expect to vigorously defend ourselves against Panavision's allegations. The Court has scheduled a claim construction hearing for December 10, 2009. At this time, we cannot estimate any possible loss or predict whether this matter will result in any material expense to us."
Silicon Motion Technology 20F
Customer concentration: "Sales to our five largest customers represented approximately 35%, 38% and 35% of our net revenue in 2006, 2007 and 2008, respectively. In 2008, Samsung Electronics was our largest customer and accounted for approximately 10% of our sales."
Sales by product line:
Assembly and test: "We currently engage companies such as SPIL, Taiwan IC Packaging (TICP), King Yuan Electronics, and Youngtek Electronics in Taiwan and Amkor in Korea as our primary subcontractors for the assembly and testing of our products."
Patent foundation: "As of June 23, 2009, we had 91 patents in China, Japan, Korea, Taiwan, and the United States and 297 patents pending."
Sales by product line:
- Mobile storage including controllers for flash memory cards, USB flash drives, SSDs, embedded flash applications, and flash card readers. NTS 4.1M or 75% of sales
- Mobile communications including mobile TV IC solutions, CDMA RF ICs, and electronic toll collection RF ICs. NTS 0.965M or 17% of sales
- Multimedia SoCs including graphics processors, PC camera SoCs, and MP3 SoCs. NTS .402M or 7% of sales
- Other 1% of sales
Assembly and test: "We currently engage companies such as SPIL, Taiwan IC Packaging (TICP), King Yuan Electronics, and Youngtek Electronics in Taiwan and Amkor in Korea as our primary subcontractors for the assembly and testing of our products."
Patent foundation: "As of June 23, 2009, we had 91 patents in China, Japan, Korea, Taiwan, and the United States and 297 patents pending."
Wednesday, June 10, 2009
GSI Technology 10K
Customer concentration: "Based on information provided to us by consignment warehouses and contract manufacturers, purchases by Cisco Systems represented approximately 26%, 28% and 30% of our net revenues in fiscal 2009, 2008 and 2007, respectively."
Other dominant customers: Alcatel-Lucent, Ericsson, Honeywell, Huawei Technologies, Motorola, Raytheon, Tellabs, ZTE
Process technology and partner: "Most of our products are implemented using 0.13 micron and 90 nanometer process technologies on 300 millimeter wafers using process technology developed by TSMC. We currently have five separate product families in production using the 0.13 micron process. Our 72 megabit SigmaQuad, 72 megabit synchronous BurstRAM and NBT SRAM and our 36 megabit SigmaQuad products are currently manufactured using 90 nanometer process technology. We are also developing new synchronous SRAMs using 65 nanometer process technology."
Assembly and test: "All of our manufactured wafers are tested for electrical compliance and most are packaged at Advanced Semiconductor Engineering, or ASE, which is located in Taiwan. Our test procedures require that all of our products be subjected to accelerated burn-in and extensive functional electrical testing, a significant portion of which occurs at Sigurd Microelectronics Co. and King Yuan Electronics Company."
Patent foundation: "We currently hold five United States patents and have several patent applications pending."
Employees: "As of March 31, 2009, we had 108 full-time employees, including 48 engineers, of which 31 are in research and development and 29 have PhD or MS degrees, 18 employees in sales and marketing, eight employees in general and administrative capacities and 52 employees in manufacturing. Of these employees, 43 are based in our Santa Clara facility and 45 are based in our Taiwan facility."
Other dominant customers: Alcatel-Lucent, Ericsson, Honeywell, Huawei Technologies, Motorola, Raytheon, Tellabs, ZTE
Process technology and partner: "Most of our products are implemented using 0.13 micron and 90 nanometer process technologies on 300 millimeter wafers using process technology developed by TSMC. We currently have five separate product families in production using the 0.13 micron process. Our 72 megabit SigmaQuad, 72 megabit synchronous BurstRAM and NBT SRAM and our 36 megabit SigmaQuad products are currently manufactured using 90 nanometer process technology. We are also developing new synchronous SRAMs using 65 nanometer process technology."
Assembly and test: "All of our manufactured wafers are tested for electrical compliance and most are packaged at Advanced Semiconductor Engineering, or ASE, which is located in Taiwan. Our test procedures require that all of our products be subjected to accelerated burn-in and extensive functional electrical testing, a significant portion of which occurs at Sigurd Microelectronics Co. and King Yuan Electronics Company."
Patent foundation: "We currently hold five United States patents and have several patent applications pending."
Employees: "As of March 31, 2009, we had 108 full-time employees, including 48 engineers, of which 31 are in research and development and 29 have PhD or MS degrees, 18 employees in sales and marketing, eight employees in general and administrative capacities and 52 employees in manufacturing. Of these employees, 43 are based in our Santa Clara facility and 45 are based in our Taiwan facility."
Saturday, June 6, 2009
MoSys Acquires Prism Circuits, Inc.
SUNNYVALE, Calif.--(BUSINESS WIRE)--MoSys, Inc. (NASDAQ: MOSY), a leading provider of high-density system-on-chip (SoC) memory intellectual property (IP), today announced the acquisition of substantially all of the assets and business of privately held Prism Circuits, Inc., a profitable supplier of high data rate parallel and serial interface (I/O) IP. The acquisition is expected to result in the following benefits:
Under the terms of the agreement, MoSys paid approximately $13.5 million at the closing, and potentially will pay an additional earn-out amount of up to $6.5 million after the first anniversary of the closing date, subject to the attainment of specified milestones during the initial 12-month post-acquisition period. MoSys has not assumed any Prism stock options or employee equity incentive awards but has agreed to grant up to a maximum of 3.7 million shares of MoSys common stock under stock options or restricted stock units (RSUs) to 25 newly hired former Prism Circuits employees (with one RSU share equated to three option shares for this purpose).
- Expand MoSys’ product portfolio and addressable markets with the addition of highly valued and differentiated IP
- Accelerate the growth opportunity for MoSys’ 1T-SRAM IP in the networking and communications markets and provide stronger customer synergies
- Increase revenue and generate positive cash flow for the second half of 2009 and 2010
- Add a world-class team of engineers, including a highly talented, cost-efficient engineering design center in India
Under the terms of the agreement, MoSys paid approximately $13.5 million at the closing, and potentially will pay an additional earn-out amount of up to $6.5 million after the first anniversary of the closing date, subject to the attainment of specified milestones during the initial 12-month post-acquisition period. MoSys has not assumed any Prism stock options or employee equity incentive awards but has agreed to grant up to a maximum of 3.7 million shares of MoSys common stock under stock options or restricted stock units (RSUs) to 25 newly hired former Prism Circuits employees (with one RSU share equated to three option shares for this purpose).
Tuesday, May 5, 2009
TSMC 6K
Wafer sales (Q1 2009) by technology:
- 45/40nm = 1%
- 65nm = 23%
- 90nm = 25%
- 0.11/0.13um = 16%
- 0.15/0.18um = 21%
- 0.25/0.35um = 11%
- 0.50um+ = 3%
Wednesday, April 1, 2009
Marvell 10K
Customer concentration: "Customers representing 10% or more of our net revenue in fiscal 2009: Western Digital 21%."
Wafer foundry: "We currently outsource a substantial percentage of our integrated circuit manufacturing to Taiwan Semiconductor Manufacturing Company, with the remaining manufacturing outsourced to other foundries primarily in Asia."
Assembly and test: "We outsource all product packaging and substantially all testing requirements for our production products to several assembly and test subcontractors, including STATS ChipPAC Ltd. and Global Testing Corporation in Singapore, Siliconware Precision Industries in Taiwan and ASE Electronics in Singapore, Taiwan and Malaysia."
Employees: "As of January 31, 2009, we had a total of 5,552 employees.........On March 5, 2009, in response to the deteriorating global economic environment we announced plans to lower our overall costs and expenses. As a result of this plan and combined with certain cost reduction measures taken in the fourth quarter of fiscal 2009, we plan to reduce our global workforce by approximately 15%, or approximately 850 employees..........We have substantial operations, including approximately 21% of our workforce as of January 31, 2009, in Israel. "
Patent foundation: "As of January 31, 2009, we have been issued and/or have acquired over 850 U.S. patents and over 200 foreign patents and we have more than 2,300 U.S. and foreign pending patent applications on various aspects of our technology, with expiration dates ranging approximately from 2010 to 2027."
New patent litigation: "On March 6, 2009, Carnegie Mellon University filed a complaint in the United States District Court for the Western District of Pennsylvania naming MSI and the Company and alleging patent infringement. Carnegie Mellon has asserted two patents purportedly relating to hard disk drive products that incorporate read-channel integrated circuits. Because this action was only recently filed, MSI and the Company have not yet answered the complaint. The Company is in the process of reviewing these patents and hiring counsel to defend us in this action. This action is in the very early stages, however, the Company intends to contest this action vigorously, but is unable to predict the outcome of this action."
Wafer foundry: "We currently outsource a substantial percentage of our integrated circuit manufacturing to Taiwan Semiconductor Manufacturing Company, with the remaining manufacturing outsourced to other foundries primarily in Asia."
Assembly and test: "We outsource all product packaging and substantially all testing requirements for our production products to several assembly and test subcontractors, including STATS ChipPAC Ltd. and Global Testing Corporation in Singapore, Siliconware Precision Industries in Taiwan and ASE Electronics in Singapore, Taiwan and Malaysia."
Employees: "As of January 31, 2009, we had a total of 5,552 employees.........On March 5, 2009, in response to the deteriorating global economic environment we announced plans to lower our overall costs and expenses. As a result of this plan and combined with certain cost reduction measures taken in the fourth quarter of fiscal 2009, we plan to reduce our global workforce by approximately 15%, or approximately 850 employees..........We have substantial operations, including approximately 21% of our workforce as of January 31, 2009, in Israel. "
Patent foundation: "As of January 31, 2009, we have been issued and/or have acquired over 850 U.S. patents and over 200 foreign patents and we have more than 2,300 U.S. and foreign pending patent applications on various aspects of our technology, with expiration dates ranging approximately from 2010 to 2027."
New patent litigation: "On March 6, 2009, Carnegie Mellon University filed a complaint in the United States District Court for the Western District of Pennsylvania naming MSI and the Company and alleging patent infringement. Carnegie Mellon has asserted two patents purportedly relating to hard disk drive products that incorporate read-channel integrated circuits. Because this action was only recently filed, MSI and the Company have not yet answered the complaint. The Company is in the process of reviewing these patents and hiring counsel to defend us in this action. This action is in the very early stages, however, the Company intends to contest this action vigorously, but is unable to predict the outcome of this action."
Tuesday, March 31, 2009
Leadis Technology 10K
Customer concentration: "In 2008, our two largest customers, Samsung SDI Corporation and Rikei Corporation, a sales distributor in Japan, accounted for approximately 24% and 38% of our revenue, respectively."
Wafer foundry: "Our foundry suppliers fabricate our display driver products using a customized, high-voltage version of their mature and stable CMOS process technology with feature sizes of 0.15 micron and higher. Our LED and touch controller products are fabricated on mature CMOS processes. Our principal foundry suppliers are Seiko Epson in Japan, and Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Corporation and United Microelectronics Corporation in Taiwan, but we may use other foundry suppliers in the future. "
Assembly and test: "We currently rely primarily on Chipbond Technology Corporation, International Semiconductor Technology Ltd. and King Yuan Electronics Co., Ltd., each located in Taiwan, and Unisem Group in Malaysia, to assemble and test our products."
Patent foundation and sales: "As of March 15, 2009, we had twenty U.S patents applications pending and had been issued nine U.S. patents. These patent applications and issued patents cover our intellectual property contained in our LED drivers, power management and touch technology products. In January 2009, we sold our display driver business including a number of relevant patents. In February 2009, we sold assets relating to a development-stage power management product, including one issued patent. In March 2009, we sold assets related to our audio products, including a number of patents and pending patents."
Employees: "As of December 31, 2008, we had 161 employees, including 100 in research and development, 23 in operations and 38 in sales, marketing, general and administrative functions. By region, 59 of our employees were located in the United States, 69 in Korea and 33 in Asia and Europe. At the end of 2007, we had 184 employees. Through sales of portions of our business and related transfers of headcount, as well as staff reductions enacted to reduce operating expenses, our headcount declined to 89 as of March 14, 2009."
Business sales: "In January 2009, we sold our display driver assets and transferred certain employees to AsTEK, Inc., a privately-held company located in Korea whose principal is the former general manager of our Korean R&D operation. The total consideration was $3.5 million in the form of a receivable due no later than January 2010 plus $0.5 million of assumed liabilities. We retained rights to most of the current display driver products in production, as well as ownership of our proprietary EpiC™ technology for AM-OLED displays. As a result of this transaction, we have ceased investment in the production, marketing and sale of new display driver integrated circuits.
In February 2009, we sold assets relating to a development-stage power management product. We sold these assets and transferred certain employees to a publicly-traded supplier of analog and mixed-signal semiconductor products. Under the terms of the sale, we will be paid $2.3 million in cash, of which $2 million has been received to date. As a result of this transaction, we ceased development of power management integrated circuits.
In March 2009, we sold assets related to our audio products and transferred certain employees to a publicly-traded supplier of semiconductor products. Under the terms of the sale, we were paid $1.45 million in cash, all of which has been received."
Wafer foundry: "Our foundry suppliers fabricate our display driver products using a customized, high-voltage version of their mature and stable CMOS process technology with feature sizes of 0.15 micron and higher. Our LED and touch controller products are fabricated on mature CMOS processes. Our principal foundry suppliers are Seiko Epson in Japan, and Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Corporation and United Microelectronics Corporation in Taiwan, but we may use other foundry suppliers in the future. "
Assembly and test: "We currently rely primarily on Chipbond Technology Corporation, International Semiconductor Technology Ltd. and King Yuan Electronics Co., Ltd., each located in Taiwan, and Unisem Group in Malaysia, to assemble and test our products."
Patent foundation and sales: "As of March 15, 2009, we had twenty U.S patents applications pending and had been issued nine U.S. patents. These patent applications and issued patents cover our intellectual property contained in our LED drivers, power management and touch technology products. In January 2009, we sold our display driver business including a number of relevant patents. In February 2009, we sold assets relating to a development-stage power management product, including one issued patent. In March 2009, we sold assets related to our audio products, including a number of patents and pending patents."
Employees: "As of December 31, 2008, we had 161 employees, including 100 in research and development, 23 in operations and 38 in sales, marketing, general and administrative functions. By region, 59 of our employees were located in the United States, 69 in Korea and 33 in Asia and Europe. At the end of 2007, we had 184 employees. Through sales of portions of our business and related transfers of headcount, as well as staff reductions enacted to reduce operating expenses, our headcount declined to 89 as of March 14, 2009."
Business sales: "In January 2009, we sold our display driver assets and transferred certain employees to AsTEK, Inc., a privately-held company located in Korea whose principal is the former general manager of our Korean R&D operation. The total consideration was $3.5 million in the form of a receivable due no later than January 2010 plus $0.5 million of assumed liabilities. We retained rights to most of the current display driver products in production, as well as ownership of our proprietary EpiC™ technology for AM-OLED displays. As a result of this transaction, we have ceased investment in the production, marketing and sale of new display driver integrated circuits.
In February 2009, we sold assets relating to a development-stage power management product. We sold these assets and transferred certain employees to a publicly-traded supplier of analog and mixed-signal semiconductor products. Under the terms of the sale, we will be paid $2.3 million in cash, of which $2 million has been received to date. As a result of this transaction, we ceased development of power management integrated circuits.
In March 2009, we sold assets related to our audio products and transferred certain employees to a publicly-traded supplier of semiconductor products. Under the terms of the sale, we were paid $1.45 million in cash, all of which has been received."
EZchip Technologies 20F
Customer concentration: "Two major tier-1 CESR (carrier Ethernet switches/routers) vendors are building several of their CESR platforms based on EZchip Technologies network processors: Juniper Networks, which accounted for approximately 55% of our 2008 revenues, entered production with NP-2 based products in 2007 and continued to launch additional products that incorporate our NPUs during 2008..........A second major vendor has selected a customized version of NP-3, developed in collaboration with Marvell, for its principal CESR platforms. This CESR vendor accounted for a relatively minor portion of our revenues in 2008 and entered production during the first quarter of 2009 with platforms that incorporate our customized NP-3 processor developed in collaboration with Marvell."
Revenue ramp: "Our 2008 revenues increased 72% to $33.6 million, up from $19.5 million in 2007. This increase in revenues is primarily attributable to increased purchases by a limited number of large NP-2 customers who entered the production stage for networking products that incorporate our network processor chips. Combined sales of NP-2 and NP-3 products accounted for 85% of our 2008 revenues; NP-1 products contributed an additional 13%; and the remaining 2% resulted primarily from the sale of software tools and services."
Patent foundation: "We hold four United States patents, No. 6,532,457, No. 6,594,655, No. 6,625,612 and No. 6,778,534."
Employees: "As of March 30, 2009, we had 116 employees. (84 R&D, 15 Sales & Marketing, 9 Operations, 8 G&A)
Wafer foundry: "Our NP-1c network processors utilize IBM’s 0.11-micron Cu-11 ASIC template. IBM also manufactures our NP-3 line of products using the 90 nanometer process. Taiwan Semiconductor Manufacturing Co., or TSMC, manufactures our NP-2 line of products using the 0.13 micron process and the special version of our NP-3 NPU, which we developed with Marvell, and will manufacture our NPA line of products, using the 90 nanometer process......We recently entered into an agreement with Marvell pursuant to which Marvell will be the vendor for our NP-4 network processor. The NP-4 network processor will also be manufactured by TSMC using the 55 nanometer process."
Revenue ramp: "Our 2008 revenues increased 72% to $33.6 million, up from $19.5 million in 2007. This increase in revenues is primarily attributable to increased purchases by a limited number of large NP-2 customers who entered the production stage for networking products that incorporate our network processor chips. Combined sales of NP-2 and NP-3 products accounted for 85% of our 2008 revenues; NP-1 products contributed an additional 13%; and the remaining 2% resulted primarily from the sale of software tools and services."
Patent foundation: "We hold four United States patents, No. 6,532,457, No. 6,594,655, No. 6,625,612 and No. 6,778,534."
Employees: "As of March 30, 2009, we had 116 employees. (84 R&D, 15 Sales & Marketing, 9 Operations, 8 G&A)
Wafer foundry: "Our NP-1c network processors utilize IBM’s 0.11-micron Cu-11 ASIC template. IBM also manufactures our NP-3 line of products using the 90 nanometer process. Taiwan Semiconductor Manufacturing Co., or TSMC, manufactures our NP-2 line of products using the 0.13 micron process and the special version of our NP-3 NPU, which we developed with Marvell, and will manufacture our NPA line of products, using the 90 nanometer process......We recently entered into an agreement with Marvell pursuant to which Marvell will be the vendor for our NP-4 network processor. The NP-4 network processor will also be manufactured by TSMC using the 55 nanometer process."
Friday, March 20, 2009
Silicon Storage Technology 10K
Wafer foundry and die sort: "During 2008, our major wafer fabrication foundries were TSMC, Grace, HHNEC and Seiko-Epson. In 2008, wafer sort, which is the process of testing individual die on silicon wafer, was performed at King Yuan Electronics Company, Limited, or KYE, Lingsen, HHNEC, Sanyo, Seiko-Epson and TSMC...........In 2001 and 2004, we invested an aggregate of $83.2 million in GSMC, a Cayman Islands company. Bing Yeh, our President, CEO and Chairman of our Board of Directors, is also a member of GSMC’s board of directors. GSMC has a wholly owned subsidiary, Shanghai Grace Semiconductor Manufacturing Corporation, or Grace, which is a wafer foundry company with operations in Shanghai, China. Grace began to manufacture our products in late 2003."
Assembly and test: "The subcontractors with the largest amount of our activity were KYE, Lingsen, and Powertech Technology, Incorporated, or PTI. We hold equity investments in three subcontractors: Apacer Technology, Inc., or Apacer, KYE and PTI."
Employees: "As of December 31, 2008, we employed 614 individuals on a full-time basis, 282 of whom reside in the United States. Of these 614 employees, 92 were employed in manufacturing support, 286 in engineering, 112 in sales and marketing and 124 in administration, finance and information technology."
Patent foundation: "As of December 31, 2008, we held 261 patents in the United States relating to certain aspects of our products and processes......."
Recent legal action: "On or about July 13, 2007, a patent infringement suit was brought by OPTi Inc. in the United States District Court for the Eastern District of Texas alleging infringement of two United State patents related to a “Compact ISA-bus Interface”. The plaintiff sought a permanent injunction, and damages for alleged past infringement, as well as any other relief the court may grant that is just and proper. On January 1, 2009, OPTi and SST resolved our differences and the suit was dismissed with prejudice."
Assembly and test: "The subcontractors with the largest amount of our activity were KYE, Lingsen, and Powertech Technology, Incorporated, or PTI. We hold equity investments in three subcontractors: Apacer Technology, Inc., or Apacer, KYE and PTI."
Employees: "As of December 31, 2008, we employed 614 individuals on a full-time basis, 282 of whom reside in the United States. Of these 614 employees, 92 were employed in manufacturing support, 286 in engineering, 112 in sales and marketing and 124 in administration, finance and information technology."
Patent foundation: "As of December 31, 2008, we held 261 patents in the United States relating to certain aspects of our products and processes......."
Recent legal action: "On or about July 13, 2007, a patent infringement suit was brought by OPTi Inc. in the United States District Court for the Eastern District of Texas alleging infringement of two United State patents related to a “Compact ISA-bus Interface”. The plaintiff sought a permanent injunction, and damages for alleged past infringement, as well as any other relief the court may grant that is just and proper. On January 1, 2009, OPTi and SST resolved our differences and the suit was dismissed with prejudice."
Wednesday, March 18, 2009
AuthenTec 10K
Business basis: "Since our inception in 1998, we have shipped over 44 million (fingerprint) sensors which have been integrated into over 250 different models of laptops, desktops and PC peripherals as well as over 9 million mobile phones. In response to increased demand, we shipped over 17.7 million sensor units in 2008, a 39% increase over the 12.7 million sensor units we shipped in 2007. Correspondingly, our revenue increased over the same period from $52.3 million in 2007 to $63.9 million in 2008, a 22% increase."
Customer concentration: " In fiscal 2008, Hewlett-Packard Company, Fujitsu Ltd. and Lenovo Group Ltd., either directly or through their suppliers, accounted for 41%, 14% and 11%, respectively, of our revenue in 2008. Our top five end customers accounted for 78% of our revenue in fiscal 2008 and 85% of our revenue in fiscal 2007. "
Wafer foundry: "We currently outsource most of our semiconductor fabrication to TSMC."
Wafer bumping: "We outsource most of the wafer gold bumping of our products to Chipbond in Taiwan....."
Assembly and test: "We outsource all assembly and testing of our products to subcontractors, Signetics in South Korea and ChipMOS in Taiwan."
Employees: "As of January 2, 2009, we had 130 full-time employees, including 83 in research and development, five in operations, 26 in sales and marketing and 16 in general and administrative functions."
Patent foundation: "Our proprietary technologies are protected by 47 issued U.S. patents and 27 U.S. patent applications."
Customer concentration: " In fiscal 2008, Hewlett-Packard Company, Fujitsu Ltd. and Lenovo Group Ltd., either directly or through their suppliers, accounted for 41%, 14% and 11%, respectively, of our revenue in 2008. Our top five end customers accounted for 78% of our revenue in fiscal 2008 and 85% of our revenue in fiscal 2007. "
Wafer foundry: "We currently outsource most of our semiconductor fabrication to TSMC."
Wafer bumping: "We outsource most of the wafer gold bumping of our products to Chipbond in Taiwan....."
Assembly and test: "We outsource all assembly and testing of our products to subcontractors, Signetics in South Korea and ChipMOS in Taiwan."
Employees: "As of January 2, 2009, we had 130 full-time employees, including 83 in research and development, five in operations, 26 in sales and marketing and 16 in general and administrative functions."
Patent foundation: "Our proprietary technologies are protected by 47 issued U.S. patents and 27 U.S. patent applications."
Monday, March 16, 2009
Pixelworks 10K
Revenue by segment for year ending 12/31/2008:
Customer concentration: "Revenue attributable to our top five end customers represented 55%, 47% and 39% of revenue for the years ended December 31, 2008, 2007 and 2006, respectively. End customers include customers who purchase directly from us as well as customers who purchase products indirectly through distributors and manufacturers’ representatives. During 2008, we sold product directly to Seiko Epson Corporation who represented 24% of revenue for the year ended December 31, 2008 and accounted for 20% of accounts receivable at December 31, 2008. Revenue attributable to Seiko Epson Corporation was 21% and 15% of revenue for the years ended December 31, 2007 and 2006, respectively. No other end customer accounted for more than 10% of revenue during the years ended December 31, 2008, 2007 and 2006."
Wafer foundry: "Our wafers are fabricated by Semiconductor Manufacturing International Corporation (“SMIC”), Taiwan Semiconductor Manufacturing Corporation and Toshiba Corporation."
Employees: "As of December 31, 2008, we had a total of 229 employees comprised of 130 in engineering; 48 in sales and marketing, of which 18 are field application engineers and 30 are sales and marketing staff; 18 in operations; and 33 in administration, including finance, information technology, human resources and general administration. Of the 229 employees, 50 were located in the United States as of December 31, 2008."
Patent foundation: "Currently, we hold 90 patents and have 64 patent applications pending, which relate generally to improvements in the visual display of digital image data including, but not limited to, improvements in image scaling, image correction, automatic image optimization and video signal processing for digital displays."
- Digital projector $52.9M (down 10%)
- Advanced television $11.2M (down 44%)
- Advanced media processor $11.3M (down 30%)
- LCD monitor, panel and other $9.7M (down 15%)
Customer concentration: "Revenue attributable to our top five end customers represented 55%, 47% and 39% of revenue for the years ended December 31, 2008, 2007 and 2006, respectively. End customers include customers who purchase directly from us as well as customers who purchase products indirectly through distributors and manufacturers’ representatives. During 2008, we sold product directly to Seiko Epson Corporation who represented 24% of revenue for the year ended December 31, 2008 and accounted for 20% of accounts receivable at December 31, 2008. Revenue attributable to Seiko Epson Corporation was 21% and 15% of revenue for the years ended December 31, 2007 and 2006, respectively. No other end customer accounted for more than 10% of revenue during the years ended December 31, 2008, 2007 and 2006."
Wafer foundry: "Our wafers are fabricated by Semiconductor Manufacturing International Corporation (“SMIC”), Taiwan Semiconductor Manufacturing Corporation and Toshiba Corporation."
Employees: "As of December 31, 2008, we had a total of 229 employees comprised of 130 in engineering; 48 in sales and marketing, of which 18 are field application engineers and 30 are sales and marketing staff; 18 in operations; and 33 in administration, including finance, information technology, human resources and general administration. Of the 229 employees, 50 were located in the United States as of December 31, 2008."
Patent foundation: "Currently, we hold 90 patents and have 64 patent applications pending, which relate generally to improvements in the visual display of digital image data including, but not limited to, improvements in image scaling, image correction, automatic image optimization and video signal processing for digital displays."
Mosys 10K
Customers concentration (IP sales): "Our overall revenue has been highly concentrated, with a few customers accounting for a significant percentage of our total revenue. For the year ended December 31, 2008, NEC and TSMC represented 55% and 13% of total revenue, respectively.......We have license agreements with many companies, including, but not limited to, Agilent Technologies, Analog Devices, Inc., Broadcom Corporation, Dialog Semiconductor, eSilicon Corporation, Fujitsu, Himax Technologies, Ltd., Hitachi, Ltd., Kawasaki Micoroelectronics, Inc., Keyasic Ltd., LG Electronics, Inc., LSI Logic Corporation, Marvell Semiconductor, Inc., Matsushita Communication Industrial Co., Ltd., National Semiconductor Corporation, NEC, Nexuschips Co. Ltd., Open-Silicon, Inc., Orise Technology Co. Inc., Philips Semiconductors, Inc., Pixelworks, Inc., Pixim, Inc., Progate Group Corporation, Realtek Semiconductor Corporation, Sicon Semiconductor AB, Silterra, SMIC, Sanyo Electric Co., Ltd., Sony Corporation, TSMC, UMC, Via Technologies, Inc., and Yamaha Corporation."
Employees: "As of December 31, 2008, we had 191 employees, consisting of 164 in research and development and engineering, 15 in sales and marketing and 12 in finance and administration. Under our plan to exit the analog/mixed-signal product lines, we expect to eliminate 90 research and development and engineering positions in the first half of 2009. "
Patent foundation: "As of December 31, 2008, we held approximately 95 U.S. and approximately 48 foreign patents on various aspects of our memory technology, with expiration dates ranging from 2012 to 2027. We currently have approximately 64 pending patent applications in the U.S. and abroad."
Employees: "As of December 31, 2008, we had 191 employees, consisting of 164 in research and development and engineering, 15 in sales and marketing and 12 in finance and administration. Under our plan to exit the analog/mixed-signal product lines, we expect to eliminate 90 research and development and engineering positions in the first half of 2009. "
Patent foundation: "As of December 31, 2008, we held approximately 95 U.S. and approximately 48 foreign patents on various aspects of our memory technology, with expiration dates ranging from 2012 to 2027. We currently have approximately 64 pending patent applications in the U.S. and abroad."
Friday, March 13, 2009
Nvidia 10K
Graphics processor market share: "Our share of the standalone desktop GPU category decreased from 64% to 63% in fiscal year 2009, according to the December 2007 and December 2008 PC Graphics Report from Mercury Research, respectively. Our share of the standalone notebook category decreased from 75% to 63%, according to the December 2007 and December 2008 PC Graphics Report from Mercury Research, respectively."
Gross margin collapse: "During the fourth quarter of fiscal year 2009, our gross margin declined to 29.4% as compared to 45.7% during the fourth quarter of fiscal year 2008 and decreased from 41.0% from the third quarter of fiscal year 2009."
Microsoft stock rights: "On March 5, 2000, we entered into an agreement with Microsoft in which we agreed to develop and sell graphics chips and to license certain technology to Microsoft and its licensees for use in the Xbox. Under the agreement, if an individual or corporation makes an offer to purchase shares equal to or greater than 30% of the outstanding shares of our common stock, Microsoft may have first and last rights of refusal to purchase the stock. The Microsoft provision and the other factors listed above could also delay or prevent a change in control of NVIDIA."
Recent legal activity: "On February 17, 2009, Intel Corporation filed suit against NVIDIA Corporation, seeking declaratory and injunctive relief relating to a licensing agreement that the parties signed in 2004. The lawsuit was filed in Delaware Chancery Court. Intel seeks an order from the Court declaring that the license does not extend to certain future NVIDIA chipset products, and enjoining NVIDIA from stating that it has licensing rights for these products. The lawsuit seeks no damages from NVIDIA. If Intel successfully obtains such a court order, we could be unable to sell our MCP products for use with Intel processors and our competitive position would be harmed. NVIDIA’s response to the Intel complaint is currently due on March 23, 2009." (Nvidia's cases are far too numerous to detail here, but include landlord and trustee actions relating to 3dfx's bankruptcy, SEC cases, DOJ anti-trust cases, Rambus patent infringement claims and product liability claims resulting from product reliability issues.)
Customer concentration: "Sales to our largest customer, Hewlett-Packard Company, accounted for 11% of our total revenue for fiscal year 2009."
Foundry, assembly and test: "We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Corporation, or TSMC, United Microelectronics Corporation, or UMC, Chartered Semiconductor Manufacturing, or Chartered, Semiconductor Manufacturing International Corporation, or SMIC, and Austria Micro Systems, or AMS to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, or ASE, Amkor Technology, or Amkor, JSI Logistics Ltd., or JSI, King Yuan Electronics Co., Ltd, or KYEC, Siliconware Precision Industries Company Ltd., or SPIL, and STATS ChipPAC Incorporated, or ChipPAC, to perform assembly, testing and packaging of most of our products.......Our current product families are manufactured using 0.15 micron, 0.14 micron, 0.13 micron, 0.11 micron, 90 nanometer, 65 nanometer and 55 nanometer process technologies."
Packaging reliability problem: ".....For example, in July 2008, we recorded a $196.0 million charge against cost of revenue to cover anticipated customer warranty, repair, return, replacement and other associated costs arising from a weak die/packaging material set in certain versions of our previous generation MCP and GPU products used in notebook systems."
Employees: "As of January 25, 2009 we had 5,420 employees, 3,772 of whom were engaged in research and development and 1,648 of whom were engaged in sales, marketing, operations and administrative positions."
Gross margin collapse: "During the fourth quarter of fiscal year 2009, our gross margin declined to 29.4% as compared to 45.7% during the fourth quarter of fiscal year 2008 and decreased from 41.0% from the third quarter of fiscal year 2009."
Microsoft stock rights: "On March 5, 2000, we entered into an agreement with Microsoft in which we agreed to develop and sell graphics chips and to license certain technology to Microsoft and its licensees for use in the Xbox. Under the agreement, if an individual or corporation makes an offer to purchase shares equal to or greater than 30% of the outstanding shares of our common stock, Microsoft may have first and last rights of refusal to purchase the stock. The Microsoft provision and the other factors listed above could also delay or prevent a change in control of NVIDIA."
Recent legal activity: "On February 17, 2009, Intel Corporation filed suit against NVIDIA Corporation, seeking declaratory and injunctive relief relating to a licensing agreement that the parties signed in 2004. The lawsuit was filed in Delaware Chancery Court. Intel seeks an order from the Court declaring that the license does not extend to certain future NVIDIA chipset products, and enjoining NVIDIA from stating that it has licensing rights for these products. The lawsuit seeks no damages from NVIDIA. If Intel successfully obtains such a court order, we could be unable to sell our MCP products for use with Intel processors and our competitive position would be harmed. NVIDIA’s response to the Intel complaint is currently due on March 23, 2009." (Nvidia's cases are far too numerous to detail here, but include landlord and trustee actions relating to 3dfx's bankruptcy, SEC cases, DOJ anti-trust cases, Rambus patent infringement claims and product liability claims resulting from product reliability issues.)
Customer concentration: "Sales to our largest customer, Hewlett-Packard Company, accounted for 11% of our total revenue for fiscal year 2009."
Foundry, assembly and test: "We utilize industry-leading suppliers, such as Taiwan Semiconductor Manufacturing Corporation, or TSMC, United Microelectronics Corporation, or UMC, Chartered Semiconductor Manufacturing, or Chartered, Semiconductor Manufacturing International Corporation, or SMIC, and Austria Micro Systems, or AMS to produce our semiconductor wafers. We then utilize independent subcontractors, such as Advanced Semiconductor Engineering, or ASE, Amkor Technology, or Amkor, JSI Logistics Ltd., or JSI, King Yuan Electronics Co., Ltd, or KYEC, Siliconware Precision Industries Company Ltd., or SPIL, and STATS ChipPAC Incorporated, or ChipPAC, to perform assembly, testing and packaging of most of our products.......Our current product families are manufactured using 0.15 micron, 0.14 micron, 0.13 micron, 0.11 micron, 90 nanometer, 65 nanometer and 55 nanometer process technologies."
Packaging reliability problem: ".....For example, in July 2008, we recorded a $196.0 million charge against cost of revenue to cover anticipated customer warranty, repair, return, replacement and other associated costs arising from a weak die/packaging material set in certain versions of our previous generation MCP and GPU products used in notebook systems."
Employees: "As of January 25, 2009 we had 5,420 employees, 3,772 of whom were engaged in research and development and 1,648 of whom were engaged in sales, marketing, operations and administrative positions."
Mellanox Technologies 10K
View of the InfiniBand market: "Based on data provided by IDC in April 2008 in a report called “Worldwide InfiniBand 2007-2011 Forecast Update,” the number of InfiniBand HCAs expected to ship to the market will increase at a 51.5% compound annual growth rate (CAGR) from 124,000 in 2006 to 991,000 in 2011. IDC also forecasts that the number of InfiniBand switch ports expected to ship to the market will increase at a 54.5% CAGR from 177,000 ports in 2006 to 1.56 million ports in 2011. IDC credits the growth of InfiniBand usage to increasing deployment in HPC, scale-out database, shared virtualized I/O, and financial services environments."
Customer concentration: "We sold products to more than 257 customers worldwide in the year ended December 31, 2008, many of whom are at the evaluation stage of their product development. We currently anticipate that several of these evaluations will result in increased orders for our products as they move into the production stage. In the year ended December 31, 2008, sales to Hewlett-Packard accounted for 19% of our total revenues, sales to Sun accounted for 17% of our total revenues and sales to QLogic Corporation accounted for 11% of our total revenues."
Foundry, assembly and test: "We use Taiwan Semiconductor Manufacturing Company, or TSMC, to manufacture and Advanced Semiconductor Engineering, or ASE, to assemble, package and production test our IC products. We use Flextronics to manufacture our standard adapter card products and custom adapter cards and switch systems."
Employees: "As of December 31, 2008, we had 262 full-time employees and 41 part-time employees located in the United States and Israel, including 215 in research and development, 39 in sales and marketing, 28 in general and administrative and 21 in operations. Of our 262 full-time employees, 217 are located in Israel."
Patent foundation: "As of December 31, 2008, we had 15 issued patents and 25 patent applications pending in the United States., 5 issued patents in Taiwan and 1 issued patent and 5 applications pending in Israel, each of which covers aspects of the technology in our products."
IP licensed from Vitesse: "In addition to our own IP, we also rely on third-party technologies for the development of our interconnect IC products. Pursuant to a license agreement dated September 10, 2001, Vitesse Semiconductor Corporation, or Vitesse, a provider of high-speed physical layer semiconductor products for the communications market, granted us a non-exclusive, worldwide, perpetual right and license to use and incorporate into our InfiniBand products Vitesse’s 2.5Gb/s SerDes macro cell implemented in TSMC’s 0.18 micron Complementary Metal-Oxide Semiconductor, or CMOS, processes. We agreed only to use Vitesse’s technology licensed under the agreement for integrated SerDes applications. In exchange for this license, we agreed to pay a royalty to Vitesse based on the total number of devices sold by us that use Vitesse’s technology. In February 2008, Vitesse discharged us from paying royalty payments due under this agreement."
Customer concentration: "We sold products to more than 257 customers worldwide in the year ended December 31, 2008, many of whom are at the evaluation stage of their product development. We currently anticipate that several of these evaluations will result in increased orders for our products as they move into the production stage. In the year ended December 31, 2008, sales to Hewlett-Packard accounted for 19% of our total revenues, sales to Sun accounted for 17% of our total revenues and sales to QLogic Corporation accounted for 11% of our total revenues."
Foundry, assembly and test: "We use Taiwan Semiconductor Manufacturing Company, or TSMC, to manufacture and Advanced Semiconductor Engineering, or ASE, to assemble, package and production test our IC products. We use Flextronics to manufacture our standard adapter card products and custom adapter cards and switch systems."
Employees: "As of December 31, 2008, we had 262 full-time employees and 41 part-time employees located in the United States and Israel, including 215 in research and development, 39 in sales and marketing, 28 in general and administrative and 21 in operations. Of our 262 full-time employees, 217 are located in Israel."
Patent foundation: "As of December 31, 2008, we had 15 issued patents and 25 patent applications pending in the United States., 5 issued patents in Taiwan and 1 issued patent and 5 applications pending in Israel, each of which covers aspects of the technology in our products."
IP licensed from Vitesse: "In addition to our own IP, we also rely on third-party technologies for the development of our interconnect IC products. Pursuant to a license agreement dated September 10, 2001, Vitesse Semiconductor Corporation, or Vitesse, a provider of high-speed physical layer semiconductor products for the communications market, granted us a non-exclusive, worldwide, perpetual right and license to use and incorporate into our InfiniBand products Vitesse’s 2.5Gb/s SerDes macro cell implemented in TSMC’s 0.18 micron Complementary Metal-Oxide Semiconductor, or CMOS, processes. We agreed only to use Vitesse’s technology licensed under the agreement for integrated SerDes applications. In exchange for this license, we agreed to pay a royalty to Vitesse based on the total number of devices sold by us that use Vitesse’s technology. In February 2008, Vitesse discharged us from paying royalty payments due under this agreement."
Thursday, March 12, 2009
Ikanos Communications 10K
Customer concentration: "In 2008, NEC Corporation accounted for 25%, Sagem Communications accounted for 21%, Paltek Corporation accounted for 23%, and Alcatel-Lucent accounted for 11% of our revenue.....the list of our OEM customers who have purchased at least $1.0 million of our products directly from us, through a CM or a distributor for the year ended December 28, 2008.: Alcatel-Lucent, Corecess, Inc, Dasan Networks, Inc., Motorola, Inc., Millinet Co., Ltd., NEC Corporation, Sagem Communications, Sumitomo Electronic Industries, Ltd., Thomson Telecom SPA, Ubiquoss ISP, ZyXEL."
Employees: "December 28, 2008, we had 194 employees engaged in research and development, of which 100 are employed in Bangalore and Hyderabad, India, 79 in North America and 15 in rest of world."
Wafer foundry: "We currently outsource all semiconductor wafer manufacturing to Austriamicrosystems AG, NXP Semiconductors, Semiconductor Manufacturing International Corporation, Silterra Malaysia Sdn Bhd., Taiwan Semiconductor Manufacturing Company and Tower Semiconductor Ltd."
Assembly and test: "We outsource all product packaging and all testing requirements for these products to several assembly and test subcontractors, including Advanced Semiconductor Engineering, Inc. in Taiwan and Malaysia, Global Testing Corporation in Taiwan STATSChipPAC Ltd. in Singapore and United Test and Assembly Center Ltd. in Singapore."
Patent foundation: "As of December 28, 2008, we held a total of 95 issued patents in the U.S. and abroad; we also had a number of provisional patents and applications pending."
Employees: "As of December 28, 2008, we had a total of 290 full-time employees, of whom 194 were involved in research and development, 7 in operations, and 89 in sales, marketing, finance and administration. "
Employees: "December 28, 2008, we had 194 employees engaged in research and development, of which 100 are employed in Bangalore and Hyderabad, India, 79 in North America and 15 in rest of world."
Wafer foundry: "We currently outsource all semiconductor wafer manufacturing to Austriamicrosystems AG, NXP Semiconductors, Semiconductor Manufacturing International Corporation, Silterra Malaysia Sdn Bhd., Taiwan Semiconductor Manufacturing Company and Tower Semiconductor Ltd."
Assembly and test: "We outsource all product packaging and all testing requirements for these products to several assembly and test subcontractors, including Advanced Semiconductor Engineering, Inc. in Taiwan and Malaysia, Global Testing Corporation in Taiwan STATSChipPAC Ltd. in Singapore and United Test and Assembly Center Ltd. in Singapore."
Patent foundation: "As of December 28, 2008, we held a total of 95 issued patents in the U.S. and abroad; we also had a number of provisional patents and applications pending."
Employees: "As of December 28, 2008, we had a total of 290 full-time employees, of whom 194 were involved in research and development, 7 in operations, and 89 in sales, marketing, finance and administration. "
TSMC 6K - February Sales down 59% Y/Y
Hsinchu, Taiwan, R.O.C. — March 10, 2009 — TSMC (TAIEX: 2330, NYSE: TSM) today announced its net sales for February 2009: on an unconsolidated basis, sales were approximately NT$11.50 billion, a decrease of 7.5 percent from January 2009 and a decrease of 59.5 percent from February 2008. Revenues for January through February 2009 totaled NT$23.94 billion, a decrease of 59.2 percent compared to the same period in 2008.
Wednesday, March 11, 2009
Quicklogic 10K
Wafer foundry and geometries: "We currently outsource our wafer manufacturing, primarily to TSMC and Tower. TSMC manufactures our pASIC 3, QuickRAM and certain QuickPCI products using a four-layer metal, 0.35 micron complementary metal oxide semiconductor, or CMOS, process. TSMC also manufactures our Eclipse and other mature products using a five-layer metal, 0.25 micron CMOS process on eight-inch wafers....Tower manufactures our new products, and will manufacture new products currently under development, using a six-layer metal, 0.18 micron CMOS process incorporating our ViaLink technology. We have invested $21.3 million in Tower as part of Tower's efforts to build and equip their wafer fabrication facility."
Assembly and test: "We outsource our product packaging, testing and programming primarily to Amkor Technology, Inc and Unisem (M) Berhard."
Employees: "As of December 28, 2008, we had a total of 88 employees worldwide."
Assembly and test: "We outsource our product packaging, testing and programming primarily to Amkor Technology, Inc and Unisem (M) Berhard."
Employees: "As of December 28, 2008, we had a total of 88 employees worldwide."
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