Customer concentration: "In 2008, our two largest customers, Samsung SDI Corporation and Rikei Corporation, a sales distributor in Japan, accounted for approximately 24% and 38% of our revenue, respectively."
Wafer foundry: "Our foundry suppliers fabricate our display driver products using a customized, high-voltage version of their mature and stable CMOS process technology with feature sizes of 0.15 micron and higher. Our LED and touch controller products are fabricated on mature CMOS processes. Our principal foundry suppliers are Seiko Epson in Japan, and Vanguard International Semiconductor Corporation, Taiwan Semiconductor Manufacturing Corporation and United Microelectronics Corporation in Taiwan, but we may use other foundry suppliers in the future. "
Assembly and test: "We currently rely primarily on Chipbond Technology Corporation, International Semiconductor Technology Ltd. and King Yuan Electronics Co., Ltd., each located in Taiwan, and Unisem Group in Malaysia, to assemble and test our products."
Patent foundation and sales: "As of March 15, 2009, we had twenty U.S patents applications pending and had been issued nine U.S. patents. These patent applications and issued patents cover our intellectual property contained in our LED drivers, power management and touch technology products. In January 2009, we sold our display driver business including a number of relevant patents. In February 2009, we sold assets relating to a development-stage power management product, including one issued patent. In March 2009, we sold assets related to our audio products, including a number of patents and pending patents."
Employees: "As of December 31, 2008, we had 161 employees, including 100 in research and development, 23 in operations and 38 in sales, marketing, general and administrative functions. By region, 59 of our employees were located in the United States, 69 in Korea and 33 in Asia and Europe. At the end of 2007, we had 184 employees. Through sales of portions of our business and related transfers of headcount, as well as staff reductions enacted to reduce operating expenses, our headcount declined to 89 as of March 14, 2009."
Business sales: "In January 2009, we sold our display driver assets and transferred certain employees to AsTEK, Inc., a privately-held company located in Korea whose principal is the former general manager of our Korean R&D operation. The total consideration was $3.5 million in the form of a receivable due no later than January 2010 plus $0.5 million of assumed liabilities. We retained rights to most of the current display driver products in production, as well as ownership of our proprietary EpiC™ technology for AM-OLED displays. As a result of this transaction, we have ceased investment in the production, marketing and sale of new display driver integrated circuits.
In February 2009, we sold assets relating to a development-stage power management product. We sold these assets and transferred certain employees to a publicly-traded supplier of analog and mixed-signal semiconductor products. Under the terms of the sale, we will be paid $2.3 million in cash, of which $2 million has been received to date. As a result of this transaction, we ceased development of power management integrated circuits.
In March 2009, we sold assets related to our audio products and transferred certain employees to a publicly-traded supplier of semiconductor products. Under the terms of the sale, we were paid $1.45 million in cash, all of which has been received."
Showing posts with label Chipbond. Show all posts
Showing posts with label Chipbond. Show all posts
Tuesday, March 31, 2009
Wednesday, March 18, 2009
AuthenTec 10K
Business basis: "Since our inception in 1998, we have shipped over 44 million (fingerprint) sensors which have been integrated into over 250 different models of laptops, desktops and PC peripherals as well as over 9 million mobile phones. In response to increased demand, we shipped over 17.7 million sensor units in 2008, a 39% increase over the 12.7 million sensor units we shipped in 2007. Correspondingly, our revenue increased over the same period from $52.3 million in 2007 to $63.9 million in 2008, a 22% increase."
Customer concentration: " In fiscal 2008, Hewlett-Packard Company, Fujitsu Ltd. and Lenovo Group Ltd., either directly or through their suppliers, accounted for 41%, 14% and 11%, respectively, of our revenue in 2008. Our top five end customers accounted for 78% of our revenue in fiscal 2008 and 85% of our revenue in fiscal 2007. "
Wafer foundry: "We currently outsource most of our semiconductor fabrication to TSMC."
Wafer bumping: "We outsource most of the wafer gold bumping of our products to Chipbond in Taiwan....."
Assembly and test: "We outsource all assembly and testing of our products to subcontractors, Signetics in South Korea and ChipMOS in Taiwan."
Employees: "As of January 2, 2009, we had 130 full-time employees, including 83 in research and development, five in operations, 26 in sales and marketing and 16 in general and administrative functions."
Patent foundation: "Our proprietary technologies are protected by 47 issued U.S. patents and 27 U.S. patent applications."
Customer concentration: " In fiscal 2008, Hewlett-Packard Company, Fujitsu Ltd. and Lenovo Group Ltd., either directly or through their suppliers, accounted for 41%, 14% and 11%, respectively, of our revenue in 2008. Our top five end customers accounted for 78% of our revenue in fiscal 2008 and 85% of our revenue in fiscal 2007. "
Wafer foundry: "We currently outsource most of our semiconductor fabrication to TSMC."
Wafer bumping: "We outsource most of the wafer gold bumping of our products to Chipbond in Taiwan....."
Assembly and test: "We outsource all assembly and testing of our products to subcontractors, Signetics in South Korea and ChipMOS in Taiwan."
Employees: "As of January 2, 2009, we had 130 full-time employees, including 83 in research and development, five in operations, 26 in sales and marketing and 16 in general and administrative functions."
Patent foundation: "Our proprietary technologies are protected by 47 issued U.S. patents and 27 U.S. patent applications."
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