Wafer foundries and process geometries: "All of our current semiconductors are developed and manufactured with 0.18-micron, 0.16-micron, 0.152-micron, 90-nanometer and 65-nanometer CMOS process technology. We have outsourced all of our wafer production to foundries, most of which has been outsourced to TSMC, the world’s largest foundry and our primary foundry service provider since our inception."
Assembly and test: "We have developed our own automatic testing program for semiconductors and outsource all of our assembly and testing requirements to ASE, SPIL and other sub-contractors."
Employees: "As of December 31, 2008, our workforce consisted of 674 employees, of which 639 were located in China and 35 were located in the United States. Of our employees, 55 were in sales and marketing, 74 were in general and administration, 519 were in research and development and 26 were in operations and procurement and information technology."
Patent foundation: "As of May 31, 2009, we owned 45 patents and had 375 pending patent applications in China, we owned 23 patents and had 29 pending patent applications in the United States and we had 11 pending patent applications in Europe and 5 pending PCT patent applications. We also acquired co-ownership of 20 patents and 10 pending patent applications in China. Our issued patents and pending patent applications relate primarily to technology we developed for our baseband semiconductors, including TD-SCDMA, HSDPA, HSUPA, WCDMA and GSM/GPRS technologies, and radio frequency transceivers."