COLORADO SPRINGS, CO—February 12, 2009 — U.S. semiconductor maker Ramtron International Corporation (Nasdaq: RMTR), the leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today announced that it has entered into a foundry services agreement with IBM. The companies plan to install Ramtron’s F-RAM semiconductor process technology in IBM's Burlington, Vermont, advanced wafer manufacturing facility. Once installed, the new foundry supply will serve as a foundation for the introduction of new and cost effective high-performance F-RAM semiconductor products.........Ramtron expects to generate first production wafers during 2010 on the IBM 0.18-micron wafer manufacturing process. IBM will become Ramtron’s third foundry supplier for its F-RAM semiconductor products, along with Fujitsu Limited and Texas Instruments.
In tandem with the foundry agreement, Ramtron is in the process of establishing an $11.0 million loan facility through Silicon Valley Bank to fund the capital and development costs in connection with the foundry relationship with IBM.