SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel Corporation today announced it signed a definitive agreement to acquire Fulcrum Microsystems Inc., a privately held fabless semiconductor company that designs Ethernet switch silicon for data center network providers.
“Intel is transforming from a leading server technology company to a comprehensive data center provider that offers computing, storage and networking building blocks,” said Kirk Skaugen, Intel vice president and general manager, Data Center Group. “Fulcrum Microsystems’ switch silicon, already recognized for high performance and low latency, complements Intel’s leading processors and Ethernet controllers, and will deliver our customers new levels of performance and energy efficiency while improving their economics of cloud service delivery.”
10 Gigabit Ethernet (10GbE) networks are one of the fastest-growing market segments in the data center today. As demand for data continues to increase, there is a growing need for high-performance, low-latency network switches to support evolving cloud architectures and the growth of converged networks in the enterprise. Fulcrum Microsystems designs integrated, standards-based 10GbE and 40 Gigabit Ethernet (40GbE) switch silicon that have low latency and workload balancing capabilities while helping provide superior network speeds.
Cloud computing is driving the convergence of server, storage and network technologies and solutions based around Intel® Xeon® processor solutions. IP Data Center customers need faster and more flexible networking solutions. The acquisition will fulfill an important component in Intel’s strategy to deliver comprehensive data center building blocks, from server processors and technologies to storage and networking.
“Customers in Web, financial services, technical and high-performance computing market segments appreciate the performance advantages Arista offers with our Extensible Operating System combined with switches based on Fulcrum Microsystems silicon,” said Andy Bechtolsheim, founder, chief development officer and chairman of Arista Networks. “Fulcrum Microsystems has architecture capabilities ideal for low-latency applications, and we are excited about the future possibilities of this technology as Fulcrum is acquired by Intel, the world’s largest semiconductor manufacturer.”
Founded in 1999, Fulcrum Microsystems is based in Calabasas, Calif. Additional terms of the transaction were not disclosed. The agreement is subject to the approval of Fulcrum Microsystems shareholders, regulatory approval and satisfaction of customary closing conditions. It is expected to close in the third quarter of 2011.
Showing posts with label Intel. Show all posts
Showing posts with label Intel. Show all posts
Tuesday, July 19, 2011
Monday, June 6, 2011
Intel acquires SiPort for digital radio technologies
From the SiPort web site:
Dear Valued Customer:
On May 25, 2011 Intel Corporation acquired SiPort. On behalf of Intel Corporation, we want to take this opportunity to assure you of Intel’s commitment to our customers and a seamless transition.
Digital radio is poised to become an important ingredient for handsets and other mobile devices as broadcast radio transitions from analog to digital. Intel’s acquisition of SiPort enhances our abilities to continue as the leading provider of low power, single-chip CMOS solutions enabling wide spread adoption of broadcast digital radio. SiPort’s digital radio expertise and solutions will leverage Intel’s market and technology leadership to provide best-in-class digital radio solutions.
The sales support and order management system provided by SiPort prior to the acquisition will continue in a ‘business as usual model’ for your product support needs on SiPort branded products. We are currently in transition planning phase, with the objective of making this transition as smooth as possible for you. Please be assured that as transition plans firm up we will provide you with detailed updates.
Please continue to contact the sales representative you worked with at SiPort before the acquisition for support or questions until directed otherwise by Intel through future communications.
Intel is excited about this acquisition and values your business. We look forward to working with you during this transition and in the future. Thank you in advance for your support during this transition.
Sincerely,
David Rolston
Senior Director, Mobile Wireless Group
Intel Corporation
Dear Valued Customer:
On May 25, 2011 Intel Corporation acquired SiPort. On behalf of Intel Corporation, we want to take this opportunity to assure you of Intel’s commitment to our customers and a seamless transition.
Digital radio is poised to become an important ingredient for handsets and other mobile devices as broadcast radio transitions from analog to digital. Intel’s acquisition of SiPort enhances our abilities to continue as the leading provider of low power, single-chip CMOS solutions enabling wide spread adoption of broadcast digital radio. SiPort’s digital radio expertise and solutions will leverage Intel’s market and technology leadership to provide best-in-class digital radio solutions.
The sales support and order management system provided by SiPort prior to the acquisition will continue in a ‘business as usual model’ for your product support needs on SiPort branded products. We are currently in transition planning phase, with the objective of making this transition as smooth as possible for you. Please be assured that as transition plans firm up we will provide you with detailed updates.
Please continue to contact the sales representative you worked with at SiPort before the acquisition for support or questions until directed otherwise by Intel through future communications.
Intel is excited about this acquisition and values your business. We look forward to working with you during this transition and in the future. Thank you in advance for your support during this transition.
Sincerely,
David Rolston
Senior Director, Mobile Wireless Group
Intel Corporation
Monday, February 14, 2011
InVisage Secures Series C Venture Funding led by Intel
MENLO PARK, CA and BARCELONA, SPAIN--(Marketwire - February 14, 2011) - Mobile World Congress -- InVisage Technologies, Inc. -- a Silicon Valley-based start-up that is revolutionizing the image sensor market -- today announced that it has received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's breakthroughQuantumFilm™ technology and products into mass production. Intel Capital joins InVisage's existing investors RockPort Capital, InterWest Partners, OnPoint Technologies and Charles River Ventures.
"Image sensors for smart phones and handheld devices are a huge market opportunity and InVisage is well positioned to capture significant market share," says Dave Flanagan, managing director, Intel Capital. "InVisage is the first company in a while to think differently about image sensors and we are confident that its products will lead the imaging market on a new vector of innovation."
"The image sensor industry as a whole has focused entirely on increasing the number of pixels and has failed to see the big picture. As a result, there has been a lack of new ideas in the market for some time," says Jess Lee, CEO, InVisage Technologies. "InVisage's QuantumFilm technology will bring stunning image quality and advanced new features to an industry that is desperate for true innovation."
QuantumFilm was developed by InVisage after years of research at the University of Toronto and at InVisage. The technology is based on quantum dots -- semiconductors with unique light-capture properties. QuantumFilm works by capturing an imprint of a light image, and then employing the silicon beneath it to read out the image and turn it into versatile digital signals. InVisage spent three years engineering the quantum dot material to produce highly-sensitive image sensors that integrate with standard CMOS manufacturing processes. The first application of QuantumFilm will enable high performance in tiny form factors, breaking silicon's inherent performance-resolution tradeoff.
Initially targeting cameraphone applications, which is the largest and fastest growing portion of the image sensor market, InVisage Technologies' QuantumFilm will be sampling by summer, and could be in devices early next year. More information on QuantumFilm and InVisage Technologies is available at www.invisage.com.
About InVisage Technologies, Inc.
InVisage Technologies, Inc. is a venture-backed fabless semiconductor company based in Menlo Park, Calif. that is developing QuantumFilm, a breakthrough imaging-sensing technology that will replace silicon. Its first product enables high-fidelity, high resolution images from handheld devices like camera phones and digital cameras. Founded in 2006, InVisage Technologies is venture funded by Intel Capital, RockPort Capital, InterWest Partners, OnPoint Technologies and Charles River Ventures. More information is available at www.invisage.com.
"Image sensors for smart phones and handheld devices are a huge market opportunity and InVisage is well positioned to capture significant market share," says Dave Flanagan, managing director, Intel Capital. "InVisage is the first company in a while to think differently about image sensors and we are confident that its products will lead the imaging market on a new vector of innovation."
"The image sensor industry as a whole has focused entirely on increasing the number of pixels and has failed to see the big picture. As a result, there has been a lack of new ideas in the market for some time," says Jess Lee, CEO, InVisage Technologies. "InVisage's QuantumFilm technology will bring stunning image quality and advanced new features to an industry that is desperate for true innovation."
QuantumFilm was developed by InVisage after years of research at the University of Toronto and at InVisage. The technology is based on quantum dots -- semiconductors with unique light-capture properties. QuantumFilm works by capturing an imprint of a light image, and then employing the silicon beneath it to read out the image and turn it into versatile digital signals. InVisage spent three years engineering the quantum dot material to produce highly-sensitive image sensors that integrate with standard CMOS manufacturing processes. The first application of QuantumFilm will enable high performance in tiny form factors, breaking silicon's inherent performance-resolution tradeoff.
Initially targeting cameraphone applications, which is the largest and fastest growing portion of the image sensor market, InVisage Technologies' QuantumFilm will be sampling by summer, and could be in devices early next year. More information on QuantumFilm and InVisage Technologies is available at www.invisage.com.
About InVisage Technologies, Inc.
InVisage Technologies, Inc. is a venture-backed fabless semiconductor company based in Menlo Park, Calif. that is developing QuantumFilm, a breakthrough imaging-sensing technology that will replace silicon. Its first product enables high-fidelity, high resolution images from handheld devices like camera phones and digital cameras. Founded in 2006, InVisage Technologies is venture funded by Intel Capital, RockPort Capital, InterWest Partners, OnPoint Technologies and Charles River Ventures. More information is available at www.invisage.com.
Friday, January 14, 2011
Intel and WiLAN Reach Agreement to End Litigations
OTTAWA, Canada – January 14, 2011 – Wi-LAN Inc. (TSX:WIN), a leading technology innovation and licensing company, today announced that Intel Corporation and WiLAN have signed a memorandum of understanding which calls for Intel to take a multi-year license to WiLAN’s patent portfolio and to make a series of payments to WiLAN. The agreement will include the dismissal of all litigations between the companies in the U.S. District Court for the Eastern District of Texas and in the U.S. District Court for the Northern District of California. WiLAN expects a final definitive agreement to be signed within the next few weeks. Specific financial terms of the agreement reached are confidential.
Monday, January 10, 2011
Intel and NVIDIA sign Patent Cross License Agreement with $1.5B payments to NVIDIA
From today's SEC 8K filing: Under the patent cross license agreement, Intel has granted to NVIDIA and its qualified subsidiaries, and NVIDIA has granted to Intel and Intel’s qualified subsidiaries, a non-exclusive, non-transferable, worldwide license, without the right to sublicense to all patents that are either owned or controlled by the parties at any time that have a first filing date on or before March 31, 2017, to make, have made (subject to certain limitations), use, sell, offer to sell, import and otherwise dispose of certain semiconductor- and electronic-related products anywhere in the world. NVIDIA’s rights to Intel’s patents have certain specified limitations, including but not limited to, NVIDIA is not licensed to: (1) certain microprocessors, defined in the agreement as “Intel Processors” or “Intel Compatible Processors;” (2) certain chipsets that connect to Intel Processors; and (3) certain flash memory products. Subject to the terms and conditions of the patent cross license agreement, Intel will pay NVIDIA licensing fees which in the aggregate will amount to $1.5 billion, payable in annual installments, as follows: a $300 million payment on each of January 18, 2011, January 13, 2012 and January 15, 2013 and a $200 million payment on each of January 15, 2014, 2015 and 2016.
The term of the patent cross license agreement continues until the expiration of the last to expire of the licensed patents, unless earlier terminated. NVIDIA may terminate the patent cross license agreement if Intel fails to make the required payments under the patent cross license agreement and fails to cure such non-payment within 60 days. In addition, the patent cross license agreement may be terminated in whole or in part under certain circumstances with respect to a party, if such party declares bankruptcy or undergoes a change of control.
Thursday, September 16, 2010
Intel Capital invests in Ciranova
SANTA CLARA, Calif., September 14, 2010. Ciranova Inc., a technology leader in analog IC physical design automation, announced today that Intel Capital, Intel Corporation’s global investment organization, has made an investment in the company. The funding will be used to expand the company’s sales and customer support operations and for specific extensions to the company’s technology.
Ciranova’s automated-design software helps engineers integrate complex RF, analog and mixed-signal content into nanometer-scale silicon much more densely and quickly than previously possible. Ciranova® technology is used by semiconductor companies integrating Wi-Fi, Bluetooth, SERDES and other functions into high-end system-on-chip (SoC) designs at 65nm and below.
“Silicon for consumer devices, especially mobile internet and broadband, now demands very aggressive mixed-signal integration in nanometer CMOS,” said Eric Filseth, Ciranova CEO. “But putting many radios or other analog functions into a single chip, together with digital, is extremely challenging using traditional analog methods. Our approach is much better suited to the complex process rules and large-scale designs associated with SoCs, and we’re delighted that Intel Capital has chosen to invest in our company.”
“The productivity gap in analog/mixed-signal design automation has been growing at a much faster rate than the productivity gap in digital design. Increased automation in analog design flows is needed to ensure acceptable design times for analog/mixed–signal circuits” said Shishpal Rawat, director of business enabling programs with the Design Technology Solutions Group, Intel. “Ciranova’s approach could improve turnaround time in analog layout automation, a key component of the overall analog/mixed-signal design flow.”
About Ciranova
Ciranova is an electronic design automation (EDA) company focused on large productivity improvements in RF, analog and mixed-signal IC physical design. Complementary to existing design flows and supported by leading foundries, Ciranova’s PDK and layout automation software dramatically reduces the time and effort needed to implement complex analog functionality in advanced CMOS. Ciranova is a founding member of the Interoperable PDK Libraries (IPL) Alliance and supports the Si2 OpenAccess database. For more information, visit our website at www.ciranova.com.
About Intel Capital
Intel Capital, Intel's global investment organization, makes equity investments in innovativetechnology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, home, mobility, health, consumer Internet, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$9.5 billion in over 1,050 companies in 47 countries. In that time frame, 175 portfolio companies have gone public on various exchanges around the world and 241 were acquired or participated in a merger. In 2009, Intel Capital invested US$327 million in 107 investments with approximately 50 percent of funds invested outside the United States and Canada. For more information on Intel Capital and its differentiated advantages, visit
www.intelcapital.com.
Ciranova’s automated-design software helps engineers integrate complex RF, analog and mixed-signal content into nanometer-scale silicon much more densely and quickly than previously possible. Ciranova® technology is used by semiconductor companies integrating Wi-Fi, Bluetooth, SERDES and other functions into high-end system-on-chip (SoC) designs at 65nm and below.
“Silicon for consumer devices, especially mobile internet and broadband, now demands very aggressive mixed-signal integration in nanometer CMOS,” said Eric Filseth, Ciranova CEO. “But putting many radios or other analog functions into a single chip, together with digital, is extremely challenging using traditional analog methods. Our approach is much better suited to the complex process rules and large-scale designs associated with SoCs, and we’re delighted that Intel Capital has chosen to invest in our company.”
“The productivity gap in analog/mixed-signal design automation has been growing at a much faster rate than the productivity gap in digital design. Increased automation in analog design flows is needed to ensure acceptable design times for analog/mixed–signal circuits” said Shishpal Rawat, director of business enabling programs with the Design Technology Solutions Group, Intel. “Ciranova’s approach could improve turnaround time in analog layout automation, a key component of the overall analog/mixed-signal design flow.”
About Ciranova
Ciranova is an electronic design automation (EDA) company focused on large productivity improvements in RF, analog and mixed-signal IC physical design. Complementary to existing design flows and supported by leading foundries, Ciranova’s PDK and layout automation software dramatically reduces the time and effort needed to implement complex analog functionality in advanced CMOS. Ciranova is a founding member of the Interoperable PDK Libraries (IPL) Alliance and supports the Si2 OpenAccess database. For more information, visit our website at www.ciranova.com.
About Intel Capital
Intel Capital, Intel's global investment organization, makes equity investments in innovativetechnology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, home, mobility, health, consumer Internet, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$9.5 billion in over 1,050 companies in 47 countries. In that time frame, 175 portfolio companies have gone public on various exchanges around the world and 241 were acquired or participated in a merger. In 2009, Intel Capital invested US$327 million in 107 investments with approximately 50 percent of funds invested outside the United States and Canada. For more information on Intel Capital and its differentiated advantages, visit
www.intelcapital.com.
Monday, August 30, 2010
Intel to Acquire Infineon’s Wireless Solutions Business
EUBIBERG, Germany & SANTA CLARA, Calif.--(BUSINESS WIRE)--Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon’s Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately $1.4 billion.
WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel’s strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.
“The global demand for wireless solutions continues to grow at an extraordinary rate,” said Paul Otellini, Intel president and CEO. “The acquisition of Infineon’s WLS business strengthens the second pillar of our computing strategy -- Internet connectivity -- and enables us to offer a portfolio of products that covers the full range of wireless options from Wi-Fi and 3G to WiMAX and LTE. As more devices compute and connect to the Internet, we are committed to positioning Intel to take advantage of the growth potential in every computing segment, from laptops to handhelds and beyond.”
“The sale of WLS is a strategic decision to enhance Infineon’s value. We can now fully concentrate our resources towards strong growth in our core segments Automotive (ATV), Industrial & Multimarket (IMM) and Chip Card & Security (CCS). This creates a great perspective for all Infineon customers, employees and shareholders,” said Peter Bauer, CEO of Infineon Technologies AG. “We all stand to benefit enormously from this deal. Thanks to the outstanding effort of the employees and the management during the last years, WLS is excellently positioned to grow further with the new owner who is ideally suited for this business.”
The WLS transaction is a strategic decision for Intel and Infineon. WLS complements Intel’s existing assets and enables growth in mobile computing, smartphones and embedded computing. Infineon will benefit from this by stronger addressing three central challenges to modern society – energy efficiency, mobility and security.
Intel’s goal is to expand its mobile and embedded product offerings to support additional customers and market segments, including smartphones, tablets, netbooks, notebooks and embedded computing devices. Through this effort, Intel will pair WLS’ best-in-class cellular technology with its core strengths to enable the delivery of low-power, Intel-based platforms that combine its applications processor with an expanded portfolio of wireless options -- bringing together Intel’s leadership in Wi-Fi and WiMAX with WLS’ leadership in 2G and 3G, and a combined path to accelerate 4G LTE.
Intel expects WLS to continue growing, and remaining a standalone business to ensure continuity of existing customer sales, projects and support. The business will continue to support its customers with the best solutions possible, including ARM-based products as well as Intel-based application processor platforms with leading-edge 3G slim modem solutions.
WLS today holds leading positions in the field of wireless mobility and cellular platforms for smart phones and ultra-low-cost, entry phones. WLS provides baseband processors, radio-frequency transceivers, power management integrated circuits (ICs), additional connectivity features, single-chip solutions as well as the corresponding system software. This helps to enable the smooth transmission of voice and high-speed data from the backbone of the telecommunication network to the end user’s device. With annual revenue of Euro 917 million, WLS was approximately 30 percent of Infineon’s total annual revenue of Euro 3.03 billion in the past financial year.
The board of directors of Intel and the supervisory board and the management board of Infineon have approved the transaction. It is expected to close in the first quarter of 2011, subject to certain regulatory approvals and other customary closing conditions specified in the definitive agreement.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
About Intel
Intel [NASDAQ: INTC], the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and http://blogs.intel.com.
WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel’s strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.
“The global demand for wireless solutions continues to grow at an extraordinary rate,” said Paul Otellini, Intel president and CEO. “The acquisition of Infineon’s WLS business strengthens the second pillar of our computing strategy -- Internet connectivity -- and enables us to offer a portfolio of products that covers the full range of wireless options from Wi-Fi and 3G to WiMAX and LTE. As more devices compute and connect to the Internet, we are committed to positioning Intel to take advantage of the growth potential in every computing segment, from laptops to handhelds and beyond.”
“The sale of WLS is a strategic decision to enhance Infineon’s value. We can now fully concentrate our resources towards strong growth in our core segments Automotive (ATV), Industrial & Multimarket (IMM) and Chip Card & Security (CCS). This creates a great perspective for all Infineon customers, employees and shareholders,” said Peter Bauer, CEO of Infineon Technologies AG. “We all stand to benefit enormously from this deal. Thanks to the outstanding effort of the employees and the management during the last years, WLS is excellently positioned to grow further with the new owner who is ideally suited for this business.”
The WLS transaction is a strategic decision for Intel and Infineon. WLS complements Intel’s existing assets and enables growth in mobile computing, smartphones and embedded computing. Infineon will benefit from this by stronger addressing three central challenges to modern society – energy efficiency, mobility and security.
Intel’s goal is to expand its mobile and embedded product offerings to support additional customers and market segments, including smartphones, tablets, netbooks, notebooks and embedded computing devices. Through this effort, Intel will pair WLS’ best-in-class cellular technology with its core strengths to enable the delivery of low-power, Intel-based platforms that combine its applications processor with an expanded portfolio of wireless options -- bringing together Intel’s leadership in Wi-Fi and WiMAX with WLS’ leadership in 2G and 3G, and a combined path to accelerate 4G LTE.
Intel expects WLS to continue growing, and remaining a standalone business to ensure continuity of existing customer sales, projects and support. The business will continue to support its customers with the best solutions possible, including ARM-based products as well as Intel-based application processor platforms with leading-edge 3G slim modem solutions.
WLS today holds leading positions in the field of wireless mobility and cellular platforms for smart phones and ultra-low-cost, entry phones. WLS provides baseband processors, radio-frequency transceivers, power management integrated circuits (ICs), additional connectivity features, single-chip solutions as well as the corresponding system software. This helps to enable the smooth transmission of voice and high-speed data from the backbone of the telecommunication network to the end user’s device. With annual revenue of Euro 917 million, WLS was approximately 30 percent of Infineon’s total annual revenue of Euro 3.03 billion in the past financial year.
The board of directors of Intel and the supervisory board and the management board of Infineon have approved the transaction. It is expected to close in the first quarter of 2011, subject to certain regulatory approvals and other customary closing conditions specified in the definitive agreement.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security. In the 2009 fiscal year (ending September), the company reported sales of Euro 3.03 billion with approximately 25,650 employees worldwide. With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY).
About Intel
Intel [NASDAQ: INTC], the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom and http://blogs.intel.com.
Monday, August 16, 2010
Intel to Acquire Texas Instruments’ Cable Modem Unit
SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel Corporation today announced it has signed an agreement to acquire Texas Instruments’ cable modem product line. The purchase enhances Intel’s focus on the cable industry and related consumer electronics (CE) market segments, where the company’s expertise in building advanced system-on-chip (SoC) products, based on Intel® Atom™ processors, will be applied.
Intel plans to combine Texas Instruments’ best-of-breed Puma product lines with the Data Over Cable Service Interface Specification (DOCSIS) standard technology and Intel SoCs to deliver advanced set top box, residential gateway and modem products for the cable industry. The objective is to provide cable OEMs with an open and powerful platform for delivering innovative and differentiated products to service providers that improve the video, voice and data content experience at home.
“Adding the talents of the Texas Instruments’ cable team to Intel’s efforts to bring its advanced technology to consumer electronics makes for a compelling combination,” said Bob Ferreira, general manager, Cable Segment, Intel’s Digital Home Group. “Intel is focused on delivering SoCs that provide the foundation for consumer electronics devices such as set top boxes, digital TVs, Blu-ray* disc players, companion boxes and related devices. This acquisition specifically strengthens Intel’s product offerings for the continuum of cable gateway products and reinforces Intel’s continued commitment to the cable industry.”
All employees of Texas Instruments’ cable modem team received offers to join Intel at sites in their home countries, primarily Israel, and will become part of Intel’s Digital Home Group. Additional terms of the transaction were not disclosed. The agreement is subject to regulatory review and customary closing conditions. It is expected to close in the fourth quarter of 2010.
About Intel
Intel (NASDAQ:INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at www.intel.com/pressroom and blogs.intel.com.
Monday, August 24, 2009
Xpoint Technologies, Inc. files suit against a mutitude of companies for infringement of data transfer patent
Claiming infringement their US Patent No. 5,913,028, entitled “Client/Server Data Traffic Delivery System and Method, Xpoint Technologies, Inc. has filed suit against Microsoft Corporation, Intel Corporation, Marvell Technology Group, Ltd., Marvell Semiconductor, Inc., Hewlett-Packard Company, Cypress Semiconductor Corp., QuickLogic Corporation, Qualcomm, Inc., Freescale Semiconductor Holdings I, Ltd., Freescale Semiconductor, Inc. (“Freescale Semiconductor”), Texas Instruments, Inc., Google Inc., T-Mobile USA, Inc., HTC Corporation, HTC America, Inc., Apple Inc., Sony Corporation, Telefonaktiebolaget LM Ericsson, Sony Ericsson Mobile Communications AB, Sony Ericsson Mobile Communications (USA), Inc., Philips Electronics, N.V., Philips Electronics North America Corporation, LG Electronics, Inc., LG Electronics USA, Inc., Research in Motion, Ltd., Research in Motion Corporation, Motorola, Inc., Nokia Corporation, Nokia Inc., Palm, Inc., Nvidia Corporation , Advanced Micro Devices, Inc., Dell Corporation, AT&T Inc., AT&T Mobility LLC, Verizon Communications, Inc., Cellco Partnership (“Cellco”), and Sprint Nextel Corporation.
Xpoint claims, "the ‘028 Patent invention provides significantly enhanced functionality for a variety of types of electronic devices, including without limitation cell phones, personal media players, personal computers, global positioning system (“GPS”) devices, and the like (generically, “data-processing devices”). One example of such enhanced functionality is “sideloading.” Certain cell-phone and personal media players manufactured and sold by certain Defendants use the ‘028 Patent technology to facilitate sideloading, which permits the transfer of information directly from one local device, typically a universal serial bus (“USB”) network I/O device connected to a personal computer, across a bus to the I/O of another local device such as a storage I/O device of a cell phone or personal media player, bypassing the CPU and central memory. In another example of increased functionality, the ‘028 Patent technology is infringed by processors and chipsets for computers, cell phones, and smart phones manufactured and sold by certain Defendants that use “northbridge-southbridge” architecture to transfer data directly between I/O devices across a bus that bypasses the CPU and central memory. The ‘028 Patent technology is also infringed by cell phones sold by certain Defendants that contain digital cameras and use the ‘028 Patent technology to transfer data directly from the camera sensor (input I/O) to the LCD screen (output I/O), bypassing the device’s CPU and central memory and permitting these cell phone digital cameras to function in viewfinder mode and to display images instantaneously and continuously on the screen. Yet another example of enhanced functionality made possible by the technology protected in the '028 Patent is cellular video sharing. In cellular video sharing, the output of the camera sensor of a data processing device is transferred directly to a network I/O unit of the device, bypassing the CPU and central memory of the device. Certain devices manufactured and sold by certain Defendants are capable of cellular video sharing and infringe the '028 Patent.
Xpoint claims, "the ‘028 Patent invention provides significantly enhanced functionality for a variety of types of electronic devices, including without limitation cell phones, personal media players, personal computers, global positioning system (“GPS”) devices, and the like (generically, “data-processing devices”). One example of such enhanced functionality is “sideloading.” Certain cell-phone and personal media players manufactured and sold by certain Defendants use the ‘028 Patent technology to facilitate sideloading, which permits the transfer of information directly from one local device, typically a universal serial bus (“USB”) network I/O device connected to a personal computer, across a bus to the I/O of another local device such as a storage I/O device of a cell phone or personal media player, bypassing the CPU and central memory. In another example of increased functionality, the ‘028 Patent technology is infringed by processors and chipsets for computers, cell phones, and smart phones manufactured and sold by certain Defendants that use “northbridge-southbridge” architecture to transfer data directly between I/O devices across a bus that bypasses the CPU and central memory. The ‘028 Patent technology is also infringed by cell phones sold by certain Defendants that contain digital cameras and use the ‘028 Patent technology to transfer data directly from the camera sensor (input I/O) to the LCD screen (output I/O), bypassing the device’s CPU and central memory and permitting these cell phone digital cameras to function in viewfinder mode and to display images instantaneously and continuously on the screen. Yet another example of enhanced functionality made possible by the technology protected in the '028 Patent is cellular video sharing. In cellular video sharing, the output of the camera sensor of a data processing device is transferred directly to a network I/O unit of the device, bypassing the CPU and central memory of the device. Certain devices manufactured and sold by certain Defendants are capable of cellular video sharing and infringe the '028 Patent.
Thursday, June 4, 2009
Intel to Acquire Wind River Systems for Approximately $884 Million
SANTA CLARA, Calif., June 4, 2009 – Intel Corporation has entered into a definitive agreement to acquire Wind River Systems Inc, under which Intel will acquire all outstanding Wind River common stock for $11.50 per share in cash, or approximately $884 million in the aggregate. Wind River is a leading software vendor in embedded devices, and will become part of Intel’s strategy to grow its processor and software presence outside the traditional PC and server market segments into embedded systems and mobile handheld devices. Wind River will become a wholly owned subsidiary of Intel and continue with its current business model of supplying leading-edge products and services to its customers worldwide.
The acquisition will deliver to Intel robust software capabilities in embedded systems and mobile devices, both important growth areas for the company. Embedded systems and mobile devices include smart phones, mobile Internet devices, other consumer electronics (CE) devices, in-car "info-tainment" systems and other automotive areas, networking equipment, aerospace and defense, energy and thousands of other devices. This multi-billion dollar market opportunity is increasingly becoming connected and more intelligent, requiring supporting applications and services as well as full Internet functionality.
The board of directors of Wind River has unanimously approved the transaction. It is expected to close this summer, subject to certain regulatory approvals and other conditions specified in the definitive agreement. Upon completion of the acquisition, Wind River will report into Intel’s Software and Services Group, headed by Renee James.
The acquisition will deliver to Intel robust software capabilities in embedded systems and mobile devices, both important growth areas for the company. Embedded systems and mobile devices include smart phones, mobile Internet devices, other consumer electronics (CE) devices, in-car "info-tainment" systems and other automotive areas, networking equipment, aerospace and defense, energy and thousands of other devices. This multi-billion dollar market opportunity is increasingly becoming connected and more intelligent, requiring supporting applications and services as well as full Internet functionality.
The board of directors of Wind River has unanimously approved the transaction. It is expected to close this summer, subject to certain regulatory approvals and other conditions specified in the definitive agreement. Upon completion of the acquisition, Wind River will report into Intel’s Software and Services Group, headed by Renee James.
Monday, March 2, 2009
Anadigics 10K
Revenue and mix shifts: "Net sales for the year ended December 31, 2008 for the Company’s wireless products increased 19.9% to $154.7 million compared to net sales for the year ended December 31, 2007 of $129.0 million. The net sales improvement was primarily due to increased demand for power amplifiers for 3G applications of $34.7 million or 29.1%, most significantly in WCDMA applications. The growth in 3G was partially offset by lower net sales in power amplifiers for GSM of $9.1 million or 91.5%, which resulted from the Company’s shift in market focus to 3G technologies. Net sales for the year ended December 31, 2008 for the Company’s broadband products increased to $103.5 million or 2.0% compared to net sales for the year ended December 31, 2007 of $101.5 million. The net sales improvement was due to increased demand for integrated circuits used in cable set-top boxes of $10.2 million or 55.4% partly offset by a decline in cable infrastructure and WiFi applications of $8.2 million or 9.9%."
Customer concentration: "Sales to Intel Corporation and Samsung Electronics Co., Ltd accounted for 18% and 16%, respectively, of total net sales during 2008."
Wafer source and processes: "Our six-inch diameter Gallium Arsenide (GaAs) wafer fabrication facility (fab) located at our corporate headquarters in Warren, New Jersey, has been operational since 1999. We are actively exploring future sources of additional manufacturing capacity including pursuing relationships with foundries.......We design, develop and manufacture RFICs primarily using GaAs compound semiconductor substrates with various process technologies, Metal Semiconductor Field Effect Transistors (MESFET), Pseudomorphic High Electron Mobility Transistors (pHEMT), and Heterojunction Bipolar Transistors (HBT). Our patented technology, which utilizes InGaP-plus, combines InGaP HBT and pHEMT processes on a single substrate, enabling us to integrate the PA function and the RF active switch function on the same die."
Patent foundation: "We own 65 U.S. patents and have 6 pending U.S. patent applications."
Recent material legal action: "On or about November 11, 2008, plaintiff Charlie Attias filed a putative securities class action lawsuit in the United States District Court for the District of New Jersey, captioned Charlie Attias v. Anadigics, Inc., et al., No. 3:08-cv-05572, and, on or about November 21, 2008, plaintiff Paul Kuznetz filed a related class action lawsuit in the same court, captioned Paul J. Kuznetz v. Anadigics, Inc., et al., No. 3:08-cv-05750 (jointly, the "Class Actions"). The Complaints in the Class Actions, which were consolidated by an Order of the District Court dated November 24, 2008, seek unspecified damages for alleged violations of Sections 10(b) and 20(a) of the Securities Exchange Act of 1934, as well as Rule 10b-5 promulgated thereunder, in connection with alleged misrepresentations and omissions relating to, among other things, Anadigics's manufacturing capabilities and the demand for its products. The longer of the proposed class periods alleged in the Class Actions runs from February 12, 2007 through October 22, 2008. Currently pending before the District Court are various motions by certain members of the proposed class seeking appointment as Lead Plaintiff.
On or about January 14, 2009, a shareholder's derivative lawsuit, captioned Sicari v. Anadigics, Inc., et al., No. SOM-L-88-09, was filed in the Superior Court of New Jersey, and, on or about February 2, 2009, a related shareholder's derivative lawsuit, captioned Moradzadeh v. Anadigics, Inc., et al., No. SOM-L-198-09, was filed in the same court (jointly, the "Derivative Lawsuits"). The Derivative Lawsuits seek unspecified damages for alleged state law claims against certain of the Company's current and former directors arising out of the matters at issue in the Class Actions. The plaintiffs in the Derivative Lawsuits have filed a motion seeking, among other things, to consolidate their respective suits."
Customer concentration: "Sales to Intel Corporation and Samsung Electronics Co., Ltd accounted for 18% and 16%, respectively, of total net sales during 2008."
Wafer source and processes: "Our six-inch diameter Gallium Arsenide (GaAs) wafer fabrication facility (fab) located at our corporate headquarters in Warren, New Jersey, has been operational since 1999. We are actively exploring future sources of additional manufacturing capacity including pursuing relationships with foundries.......We design, develop and manufacture RFICs primarily using GaAs compound semiconductor substrates with various process technologies, Metal Semiconductor Field Effect Transistors (MESFET), Pseudomorphic High Electron Mobility Transistors (pHEMT), and Heterojunction Bipolar Transistors (HBT). Our patented technology, which utilizes InGaP-plus, combines InGaP HBT and pHEMT processes on a single substrate, enabling us to integrate the PA function and the RF active switch function on the same die."
Patent foundation: "We own 65 U.S. patents and have 6 pending U.S. patent applications."
Recent material legal action: "On or about November 11, 2008, plaintiff Charlie Attias filed a putative securities class action lawsuit in the United States District Court for the District of New Jersey, captioned Charlie Attias v. Anadigics, Inc., et al., No. 3:08-cv-05572, and, on or about November 21, 2008, plaintiff Paul Kuznetz filed a related class action lawsuit in the same court, captioned Paul J. Kuznetz v. Anadigics, Inc., et al., No. 3:08-cv-05750 (jointly, the "Class Actions"). The Complaints in the Class Actions, which were consolidated by an Order of the District Court dated November 24, 2008, seek unspecified damages for alleged violations of Sections 10(b) and 20(a) of the Securities Exchange Act of 1934, as well as Rule 10b-5 promulgated thereunder, in connection with alleged misrepresentations and omissions relating to, among other things, Anadigics's manufacturing capabilities and the demand for its products. The longer of the proposed class periods alleged in the Class Actions runs from February 12, 2007 through October 22, 2008. Currently pending before the District Court are various motions by certain members of the proposed class seeking appointment as Lead Plaintiff.
On or about January 14, 2009, a shareholder's derivative lawsuit, captioned Sicari v. Anadigics, Inc., et al., No. SOM-L-88-09, was filed in the Superior Court of New Jersey, and, on or about February 2, 2009, a related shareholder's derivative lawsuit, captioned Moradzadeh v. Anadigics, Inc., et al., No. SOM-L-198-09, was filed in the same court (jointly, the "Derivative Lawsuits"). The Derivative Lawsuits seek unspecified damages for alleged state law claims against certain of the Company's current and former directors arising out of the matters at issue in the Class Actions. The plaintiffs in the Derivative Lawsuits have filed a motion seeking, among other things, to consolidate their respective suits."
Monday, February 23, 2009
Intel 10K
Wafer fabrication flows and facilities:
Customer concentration: "In 2008, Hewlett-Packard Company accounted for 20% of our net revenue (17% in 2007) and Dell Inc. accounted for 18% of our net revenue (18% in 2007). No other customer accounted for more than 10% of our net revenue."
Employees: "As of December 27, 2008, we had approximately 83,900 employees worldwide, with more than 50% of these employees located in the U.S. Worldwide, we had approximately 86,300 employees as of December 29, 2007 and 94,100 as of December 30, 2006."
Non-Marketable Equity Investments: "The carrying value of our non-marketable equity investment portfolio, excluding equity derivatives, totaled $4.1 billion as of December 27, 2008 ($3.4 billion as of December 29, 2007). The majority of the balance as of December 27, 2008 was concentrated in companies in the flash memory market segment and wireless connectivity market segment. Our flash memory market segment investments include our investment in IMFT of $1.7 billion ($2.2 billion as of December 29, 2007), our investment in IM Flash Singapore, LLP (IMFS) of $329 million ($146 million as of December 29, 2007), and our investment in Numonyx of $484 million. Our wireless connectivity market segment investments include our non-marketable investment in Clearwire LLC of $238 million........In addition, we regularly invest in non-marketable equity instruments of private companies, which range from early-stage companies that are often still defining their strategic direction to more mature companies with established revenue streams and business models." "During the fourth quarter of 2008, we recorded a $762 million impairment charge on our investment in Clearwire Communications, LLC (Clearwire LLC)..........We recorded a $250 million impairment charge on our investment in Numonyx B.V. during the third quarter of 2008."
NAND supply agreement with Apple: "In connection with an agreement between Intel and Apple, Inc. to supply a portion of the NAND flash memory output that we will purchase from IMFT, Apple provided a refundable $250 million pre-payment to Intel. In the fourth quarter of 2008, the NAND flash memory supply agreement was terminated, and the remaining portion of the pre-payment of $167 million was refunded to Apple."
- 45nm on 300mm wafers in Arizona, New Mexico and Israel for Microprocessors
- 65nm on 300mm wafers in Ireland, Arizona, Oregon for Chipsets & microprocessors
- 90nm on 300mm wafers in Ireland for Chipsets & microprocessors & other
- 130nm on 200mm wafers in Oregon, Massachusetts, Arizona, California for Chipsets
- 65-130nm on 200mm wafers in Ireland for NOR flash memory
- 180nm and above on 200mm wafers in Ireland for chipsets
Customer concentration: "In 2008, Hewlett-Packard Company accounted for 20% of our net revenue (17% in 2007) and Dell Inc. accounted for 18% of our net revenue (18% in 2007). No other customer accounted for more than 10% of our net revenue."
Employees: "As of December 27, 2008, we had approximately 83,900 employees worldwide, with more than 50% of these employees located in the U.S. Worldwide, we had approximately 86,300 employees as of December 29, 2007 and 94,100 as of December 30, 2006."
Non-Marketable Equity Investments: "The carrying value of our non-marketable equity investment portfolio, excluding equity derivatives, totaled $4.1 billion as of December 27, 2008 ($3.4 billion as of December 29, 2007). The majority of the balance as of December 27, 2008 was concentrated in companies in the flash memory market segment and wireless connectivity market segment. Our flash memory market segment investments include our investment in IMFT of $1.7 billion ($2.2 billion as of December 29, 2007), our investment in IM Flash Singapore, LLP (IMFS) of $329 million ($146 million as of December 29, 2007), and our investment in Numonyx of $484 million. Our wireless connectivity market segment investments include our non-marketable investment in Clearwire LLC of $238 million........In addition, we regularly invest in non-marketable equity instruments of private companies, which range from early-stage companies that are often still defining their strategic direction to more mature companies with established revenue streams and business models." "During the fourth quarter of 2008, we recorded a $762 million impairment charge on our investment in Clearwire Communications, LLC (Clearwire LLC)..........We recorded a $250 million impairment charge on our investment in Numonyx B.V. during the third quarter of 2008."
NAND supply agreement with Apple: "In connection with an agreement between Intel and Apple, Inc. to supply a portion of the NAND flash memory output that we will purchase from IMFT, Apple provided a refundable $250 million pre-payment to Intel. In the fourth quarter of 2008, the NAND flash memory supply agreement was terminated, and the remaining portion of the pre-payment of $167 million was refunded to Apple."
Wednesday, February 18, 2009
NVIDIA Responds To INTEL Court Filing
SANTA CLARA, CA. – FEBRUARY 18, 2009 – NVIDIA Corporation today responded to a Monday court filing (Court of Chancery in the State of Delaware) in which Intel alleged that the four-year-old chipset license agreement the companies signed does not extend to Intel’s future generation CPUs with “integrated” memory controllers, such as Nehalem. The filing does not impact NVIDIA chipsets that are currently being shipped.
“We are confident that our license, as negotiated, applies,” said Jen-Hsun Huang, president and CEO of NVIDIA. “At the heart of this issue is that the CPU has run its course and the soul of the PC is shifting quickly to the GPU. This is clearly an attempt to stifle innovation to protect a decaying CPU business.”
NVIDIA entered into the agreement in 2004 in order to bring platform innovations to Intel CPU based systems. In return, Intel took a license to NVIDIA’s rich portfolio of 3D, GPU, and other computing patents.
Since signing the agreement, NVIDIA has offered innovations such as SLI®, Hybrid power, and CUDA™ parallel processing. ION™, the most recent innovation, integrates a powerful NVIDIA GPU, north bridge and south bridge into one compact die. When combined with a CPU, ION enables a two-chip PC architecture for Intel processors two years ahead of Intel’s own solution. In addition, the ION platform offers 10x the performance of Intel’s current three chip design.1
The industry and consumers now count on innovations from NVIDIA. Microsoft recently endorsed ION because it offers consumers the first truly affordable premium Windows experience. Late last year Apple selected NVIDIA’s chipset for its entire new line of notebooks including the MacBook Classic, MacBook Air, MacBook and MacBook Pro. Today, companies like Acer, Alienware, Asus, Dell, Falcon Northwest, Fujitsu, Gigabyte, HP, Lenovo, MSI, NEC, and Toshiba all ship exciting innovations created by NVIDIA as a result of its agreement with Intel.
Huang said that, given the broad and growing adoption of NVIDIA’s platform innovations, it is not surprising that Intel is now initiating a dispute over a contract signed four years ago. Innovations like ION, SLI, Hybrid power, and CUDA threaten Intel’s ability to control the PC platform.
NVIDIA has been attempting to resolve the disagreement with Intel in a fair and reasonable manner for over a year. NVIDIA’s chipsets for Intel’s current CPU bus interface are not affected by the dispute.
“We are confident that our license, as negotiated, applies,” said Jen-Hsun Huang, president and CEO of NVIDIA. “At the heart of this issue is that the CPU has run its course and the soul of the PC is shifting quickly to the GPU. This is clearly an attempt to stifle innovation to protect a decaying CPU business.”
NVIDIA entered into the agreement in 2004 in order to bring platform innovations to Intel CPU based systems. In return, Intel took a license to NVIDIA’s rich portfolio of 3D, GPU, and other computing patents.
Since signing the agreement, NVIDIA has offered innovations such as SLI®, Hybrid power, and CUDA™ parallel processing. ION™, the most recent innovation, integrates a powerful NVIDIA GPU, north bridge and south bridge into one compact die. When combined with a CPU, ION enables a two-chip PC architecture for Intel processors two years ahead of Intel’s own solution. In addition, the ION platform offers 10x the performance of Intel’s current three chip design.1
The industry and consumers now count on innovations from NVIDIA. Microsoft recently endorsed ION because it offers consumers the first truly affordable premium Windows experience. Late last year Apple selected NVIDIA’s chipset for its entire new line of notebooks including the MacBook Classic, MacBook Air, MacBook and MacBook Pro. Today, companies like Acer, Alienware, Asus, Dell, Falcon Northwest, Fujitsu, Gigabyte, HP, Lenovo, MSI, NEC, and Toshiba all ship exciting innovations created by NVIDIA as a result of its agreement with Intel.
Huang said that, given the broad and growing adoption of NVIDIA’s platform innovations, it is not surprising that Intel is now initiating a dispute over a contract signed four years ago. Innovations like ION, SLI, Hybrid power, and CUDA threaten Intel’s ability to control the PC platform.
NVIDIA has been attempting to resolve the disagreement with Intel in a fair and reasonable manner for over a year. NVIDIA’s chipsets for Intel’s current CPU bus interface are not affected by the dispute.
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