SAN JOSE, CA--(Marketwire - May 10, 2011) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it has acquired Altos Design Automation, Inc., the technology leader in enabling foundation IP development for the delivery of complex SoCs at advanced nodes. Shrinking process geometries increase process variations and make creation of accurate noise, power and timing models for foundation IP very complex given smaller time-to-market windows. Altos tools enable ultra-fast and accurate characterization of memory, standard cell libraries and other foundation IP, generating required models for SoC implementation. When combined with the Cadence end-to-end Silicon Realization portfolio, the offering gives customers greater visibility into the effects of noise, timing and power at every phase of the design cycle, including foundation IP design creation, extraction, SPICE simulation, and implementation. The acquisition is another important step in delivering on the company's EDA360 vision.
"Foundation IP characterization is becoming mission critical at advanced nodes due to shrinking time-to-market windows, escalating low-power, high-speed design complexities, and variations in advanced processes," said Dr. Chi-Ping Hsu, Senior Vice President, Research and Development, Silicon Realization Group at Cadence. "By extending our Silicon Realization tool offering to include technically superior solutions that automate vital phases of the design process, we deliver the end-to-end approach that is required to ensure our customers' success."
"Altos has established itself as the technology leader in foundation IP enablement, with a proven solution in use today by many of the world's leading semiconductor and foundation IP providers," said Jim McCanny, CEO and founder, Altos. "I'm looking forward to working with Cadence to further exploit the capabilities of our characterization technology, and help deliver a more powerful combined solution that overcomes our customers' most difficult design challenges."
Altos has over 30 customers, including 11 of the top 20 semiconductor companies. Terms of the acquisition were not disclosed.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.
Tuesday, May 10, 2011
Xilinx acquires Modelware
LAS VEGAS, May 9, 2011 /PRNewswire/ -- INTEROP -- Xilinx, Inc. (Nasdaq: XLNX) today announced a major expansion of its communications portfolio to accelerate the industry's implementation of new packet processing, switching, and traffic management solutions for meeting the exponential growth in demand for high-bandwidth and feature-reach quality of service (QoS). The expansion includes the acquisition of Modelware, a leading provider of traffic management/packet processing silicon intellectual property (IP) cores and reference designs that simplify system development and enable greater differentiation for networking applications supporting 10G, 40G, 100G and beyond. Along with the expansion, Xilinx is introducing the industry's first Field Programmable Gate Array (FPGA)-based 100G traffic management reference design to help customers speed their evaluation and implementation of high bandwidth packet processing applications.
"By delivering a highly integrated solution encompassing packet processing/traffic management and an array of connectivity IP cores, together with their reference design, Xilinx is addressing the critical time to market and total cost of ownership requirements of equipment makers gearing up for the high bandwidth-granular services roll-outs underway by service providers, enterprise and data center operators," said Matthias Machowinski of Infonetics Research.
"By augmenting FPGAs that are already fine-tuned for high-bandwidth communications technology with Modelware's traffic management/packet processing portfolio, Xilinx will be extending and accelerating its ability to deliver the benefits of industry-leading programmable platforms to our large base of wired communications customers," said Krishna Rangasayee Corporate Vice President & General Manager, Xilinx Communications Business Unit. "Essentially, we are providing customers with a one stop shop that can help them address high bandwidth challenges, million-connection-network needs, and enable system capabilities that satisfy evolving demands for Quality of Service."
The Modelware acquisition strengthens Xilinx's ability to deliver FPGA-optimized packet processing, switching, and traffic management solutions that address very granular (trending to 1+ million queues) per-flow bandwidth provisioning as well as scalable high-bandwidth traffic aggregation capabilities (20G to 100G and beyond) across the service provider, enterprise networking and data center markets. Today, Modelware has the only FPGA-based IP capable of scaling to up to 100G + and running traffic rates at 150 million packets-per-second with 64B packet size on a single FPGA.
Traditionally, ASSP and network processor vendors have addressed the communications industry's challenges by either overbuilding their silicon with multiple sets of features, or adding post deployment software upgrade services, which in either case can lead to hidden costs. Over the past two to three years, service providers and system operators have been looking for "hitless" in-system upgrades and OEM vendors have turned to programmable logic to build systems that can scale, be flexible, field upgradable, customized to specific needs and offer lower total cost of ownership.
Modelware's solutions consists of very scalable, highly optimized IP cores purposefully tuned for Xilinx® FPGAs and deployed across the spectrum of packet processing, switching, and traffic management systems. Today, customers can build 100G traffic management systems based around the Virtex-6 HXT FPGAs now in production, which offer industry-leading serial bandwidth through a combination of 6.6 Gbps GTX transceivers and 11.18 Gbps GTH transceivers. As system architects look in their next generation systems to reach higher bandwidth – as well as expand the number of hierarchies, increase the number of flows and relevant per-flow policing, marking and shaping controls, on top of expanding the total number of high bandwidth ports – Xilinx's unified FPGA architecture offers a wider range of choices via migration to its 28nm 7-series FPGA families. Kintex-7 and Virtex-7 FPGAs support a wide array of memory controllers and high memory bandwidth to address the most demanding packet processing and traffic management configurations. Enabling the highest port density of any FPGA in its class, the Kintex-7 FPGA family supports up to 32, 12.5 Gbps transceivers while the Virtex-7 HT FPGA family offers up to 72, 13.1 Gbps , in combination with up to 16 , 28 Gbps transceivers.
The Modelware technology also encompasses several legacy cores such as HDLC, ATM, PWE3, which Xilinx will continue to use in order to support legacy installations such as the mobile backhaul space, and help customers with maintaining existing deployments and offer an easy migration path from TDM to all-IP solutions without a need for new hardware.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
"By delivering a highly integrated solution encompassing packet processing/traffic management and an array of connectivity IP cores, together with their reference design, Xilinx is addressing the critical time to market and total cost of ownership requirements of equipment makers gearing up for the high bandwidth-granular services roll-outs underway by service providers, enterprise and data center operators," said Matthias Machowinski of Infonetics Research.
"By augmenting FPGAs that are already fine-tuned for high-bandwidth communications technology with Modelware's traffic management/packet processing portfolio, Xilinx will be extending and accelerating its ability to deliver the benefits of industry-leading programmable platforms to our large base of wired communications customers," said Krishna Rangasayee Corporate Vice President & General Manager, Xilinx Communications Business Unit. "Essentially, we are providing customers with a one stop shop that can help them address high bandwidth challenges, million-connection-network needs, and enable system capabilities that satisfy evolving demands for Quality of Service."
The Modelware acquisition strengthens Xilinx's ability to deliver FPGA-optimized packet processing, switching, and traffic management solutions that address very granular (trending to 1+ million queues) per-flow bandwidth provisioning as well as scalable high-bandwidth traffic aggregation capabilities (20G to 100G and beyond) across the service provider, enterprise networking and data center markets. Today, Modelware has the only FPGA-based IP capable of scaling to up to 100G + and running traffic rates at 150 million packets-per-second with 64B packet size on a single FPGA.
Traditionally, ASSP and network processor vendors have addressed the communications industry's challenges by either overbuilding their silicon with multiple sets of features, or adding post deployment software upgrade services, which in either case can lead to hidden costs. Over the past two to three years, service providers and system operators have been looking for "hitless" in-system upgrades and OEM vendors have turned to programmable logic to build systems that can scale, be flexible, field upgradable, customized to specific needs and offer lower total cost of ownership.
Modelware's solutions consists of very scalable, highly optimized IP cores purposefully tuned for Xilinx® FPGAs and deployed across the spectrum of packet processing, switching, and traffic management systems. Today, customers can build 100G traffic management systems based around the Virtex-6 HXT FPGAs now in production, which offer industry-leading serial bandwidth through a combination of 6.6 Gbps GTX transceivers and 11.18 Gbps GTH transceivers. As system architects look in their next generation systems to reach higher bandwidth – as well as expand the number of hierarchies, increase the number of flows and relevant per-flow policing, marking and shaping controls, on top of expanding the total number of high bandwidth ports – Xilinx's unified FPGA architecture offers a wider range of choices via migration to its 28nm 7-series FPGA families. Kintex-7 and Virtex-7 FPGAs support a wide array of memory controllers and high memory bandwidth to address the most demanding packet processing and traffic management configurations. Enabling the highest port density of any FPGA in its class, the Kintex-7 FPGA family supports up to 32, 12.5 Gbps transceivers while the Virtex-7 HT FPGA family offers up to 72, 13.1 Gbps , in combination with up to 16 , 28 Gbps transceivers.
The Modelware technology also encompasses several legacy cores such as HDLC, ATM, PWE3, which Xilinx will continue to use in order to support legacy installations such as the mobile backhaul space, and help customers with maintaining existing deployments and offer an easy migration path from TDM to all-IP solutions without a need for new hardware.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
Monday, May 9, 2011
NVDIA acquires Icera
SANTA CLARA, Calif.—May 9, 2011— NVIDIA announced today that it has agreed to acquire Icera, a leading innovator of top-performing baseband processors for 3G and 4G cellular phones and tablets.
Icera has more than 550 patents granted or pending worldwide, and its high speed wireless-modem products have been approved by more than 50 carriers across the globe. By combining the companies’ products and technologies, including NVIDIA’s Tegra processor, NVIDIA will enhance its position as a leading player in the growing mobile market.
The acquisition, for $367 million in cash, has been approved by both companies’ boards of directors and is expected to be completed, subject to customary closing conditions, in approximately 30 days. The transaction is expected to be slightly dilutive on an operating basis through the first half of calendar 2012, and accretive on an operating basis in the second half of calendar 2012. This expectation does not take into account significant revenue synergies that the companies anticipate.
By offering the two main processors used in smartphones (the application processor and baseband processor), the combined company will help OEM customers both improve their time to market and deliver the requirements of next-generation mobile computing. NVIDIA will also have approximately doubled its revenue opportunity within each device.
The market for baseband processors is one of the fastest growing segments of the technology industry, worth an estimated $15 billion a year. Icera will be able to leverage NVIDIA’s momentum in the smartphone and tablet markets to capitalize on this growth.
Background on Icera
Icera is a pioneer in next-generation, multi-protocol wireless baseband processors with RF components. Its technology scales from 2G to 4G networks, using a custom-built, ultra-low-power processor. Because the baseband is software-based, manufacturers can develop multiple products from a common platform, reduce development costs, accelerate time to market and secure a route to support future baseband standards.
Icera’s third-generation Livanto line of chipsets delivers the industry’s fastest data rates, cuts user wait times, reduces battery drain and supports multiple standards on the same hardware. And its forthcoming Espresso®450 and Espresso®500 line of platforms provides industry-leading performance for 2G, 3G and 4G networks, low-power optimization for voice and high-speed data, and the industry’s smallest form factor. Its portfolio of products will expand significantly in the near future.
Founded in 2002 and based in Bristol, England, the company has approximately 300 employees in seven countries in Europe and Asia, as well as the U.S. It was established by a group of senior executives with strong, shared backgrounds in microprocessor design and cellular communications.
Icera has more than 550 patents granted or pending worldwide, and its high speed wireless-modem products have been approved by more than 50 carriers across the globe. By combining the companies’ products and technologies, including NVIDIA’s Tegra processor, NVIDIA will enhance its position as a leading player in the growing mobile market.
The acquisition, for $367 million in cash, has been approved by both companies’ boards of directors and is expected to be completed, subject to customary closing conditions, in approximately 30 days. The transaction is expected to be slightly dilutive on an operating basis through the first half of calendar 2012, and accretive on an operating basis in the second half of calendar 2012. This expectation does not take into account significant revenue synergies that the companies anticipate.
By offering the two main processors used in smartphones (the application processor and baseband processor), the combined company will help OEM customers both improve their time to market and deliver the requirements of next-generation mobile computing. NVIDIA will also have approximately doubled its revenue opportunity within each device.
The market for baseband processors is one of the fastest growing segments of the technology industry, worth an estimated $15 billion a year. Icera will be able to leverage NVIDIA’s momentum in the smartphone and tablet markets to capitalize on this growth.
Background on Icera
Icera is a pioneer in next-generation, multi-protocol wireless baseband processors with RF components. Its technology scales from 2G to 4G networks, using a custom-built, ultra-low-power processor. Because the baseband is software-based, manufacturers can develop multiple products from a common platform, reduce development costs, accelerate time to market and secure a route to support future baseband standards.
Icera’s third-generation Livanto line of chipsets delivers the industry’s fastest data rates, cuts user wait times, reduces battery drain and supports multiple standards on the same hardware. And its forthcoming Espresso®450 and Espresso®500 line of platforms provides industry-leading performance for 2G, 3G and 4G networks, low-power optimization for voice and high-speed data, and the industry’s smallest form factor. Its portfolio of products will expand significantly in the near future.
Founded in 2002 and based in Bristol, England, the company has approximately 300 employees in seven countries in Europe and Asia, as well as the U.S. It was established by a group of senior executives with strong, shared backgrounds in microprocessor design and cellular communications.
Thursday, April 14, 2011
Fairchild acquires Swedish Company TranSiC
Answering the need for increasing efficiencies and higher performance for semiconductor applications, Fairchild Semiconductor (NYSE: FCS) is extending its technology leadership capabilities with the acquisition of TranSiC, a Silicon Carbide (SiC) power transistor company.
The acquisition provides Fairchild with bipolar SiC transistor technology with demonstrated industry leading efficiencies and excellent performance over wide temperature ranges, and superior performance over MOSFET and JFET technology approaches. Fairchild also acquired a team of highly experienced SiC engineers and scientists and multiple patents in SiC technology.
“The combination of silicon carbide technology with Fairchild’s existing capabilities in MOSFETs, IGBTs and multi-chip modules, along with our global access to customers, positions us to continue to be a leader in innovative, high performance power transistor technology,” said Mark Thompson, Fairchild’s Chairman, CEO and president.
“The performance levels achieved with SiC technology allow for much higher efficiency in power conversion. It also offers a higher switching speed, a feature that enables smaller end system form factors. Silicon Carbide technology is established in the market with a strong lead over alternatives in the wide bandgap area for applications that require voltages greater than 600V and demonstrates superior ruggedness and reliability,” added Dan Kinzer, Fairchild’s Chief Technology Officer.
These high gain SiC bipolar devices are ideal for high-power conversion applications in down-hole drilling, solar inverters, wind-powered inverters, electric and hybrid electric vehicles, industrial drives, UPS and light rail traction applications. These markets are projected by Yole Development to approach $1 billion by 2020.
This device is capable of industry leading efficiency, cutting losses relative to established silicon approaches by up to half, or allowing an increase of frequency by up to 4X with similar losses. Overall system cost and value can benefit from much smaller, lighter passive components. For systems that require the best efficiency and power density, there is no equal.
Fairchild is sampling initial 1200V products up to 50A ratings in targeted applications. Future offerings are in development to expand the voltage and current range, and to continue to drive improved energy saving.
About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – global presence, local support, smart ideas. Fairchild delivers energy-efficient, easy-to-use and value-added semiconductor solutions for power and mobile designs. We help our customers differentiate their products and solve difficult technical challenges with our expertise in power and signal path products. Please contact us on the web at www.fairchildsemi.com.
The acquisition provides Fairchild with bipolar SiC transistor technology with demonstrated industry leading efficiencies and excellent performance over wide temperature ranges, and superior performance over MOSFET and JFET technology approaches. Fairchild also acquired a team of highly experienced SiC engineers and scientists and multiple patents in SiC technology.
“The combination of silicon carbide technology with Fairchild’s existing capabilities in MOSFETs, IGBTs and multi-chip modules, along with our global access to customers, positions us to continue to be a leader in innovative, high performance power transistor technology,” said Mark Thompson, Fairchild’s Chairman, CEO and president.
“The performance levels achieved with SiC technology allow for much higher efficiency in power conversion. It also offers a higher switching speed, a feature that enables smaller end system form factors. Silicon Carbide technology is established in the market with a strong lead over alternatives in the wide bandgap area for applications that require voltages greater than 600V and demonstrates superior ruggedness and reliability,” added Dan Kinzer, Fairchild’s Chief Technology Officer.
These high gain SiC bipolar devices are ideal for high-power conversion applications in down-hole drilling, solar inverters, wind-powered inverters, electric and hybrid electric vehicles, industrial drives, UPS and light rail traction applications. These markets are projected by Yole Development to approach $1 billion by 2020.
This device is capable of industry leading efficiency, cutting losses relative to established silicon approaches by up to half, or allowing an increase of frequency by up to 4X with similar losses. Overall system cost and value can benefit from much smaller, lighter passive components. For systems that require the best efficiency and power density, there is no equal.
Fairchild is sampling initial 1200V products up to 50A ratings in targeted applications. Future offerings are in development to expand the voltage and current range, and to continue to drive improved energy saving.
About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – global presence, local support, smart ideas. Fairchild delivers energy-efficient, easy-to-use and value-added semiconductor solutions for power and mobile designs. We help our customers differentiate their products and solve difficult technical challenges with our expertise in power and signal path products. Please contact us on the web at www.fairchildsemi.com.
Silicon Image to acquire SiBEAM
SUNNYVALE, Calif., April 14, 2011 – Silicon Image , Inc. (NASDAQ: SIMG), a leader in advanced, interoperable HD connectivity solutions for consumer electronics, today announced the signing of a definitive agreement to acquire privately-held SiBEAM, Inc. , a fabless semiconductor company headquartered in Sunnyvale, CA. SiBEAM is the leading provider of high-speed wireless communication products for uncompressed HD video in consumer electronics and personal computer applications, a founding member of the WirelessHD™ Consortium and an active member of the Wireless Gigabit Alliance (WiGig™).
The purchase price of the acquisition will be $25.5 million in cash and Silicon Image stock. The proposed transaction is expected to close in the second quarter of 2011. For 2011, the acquisition is anticipated to be dilutive to Silicon Image’s non-GAAP earnings by approximately $0.06 - $0.08 and neutral to earnings for 2012. The company intends to finalize its estimates of the transaction’s financial impact as well as the accounting for the transaction upon deal close.
“The acquisition of SiBEAM underscores our stated mission to be the leader in advanced video connectivity solutions and SiBEAM’s 60GHz wireless technology will enable us to rapidly bring the highest quality of wirelessly transmitted HD video and audio to market,” said Camillo Martino, chief executive officer of Silicon Image, Inc. “Silicon Image has a proven history of establishing successful global connectivity standards, including DVI®, HDMI®, and most recently MHL™ and we are looking forward to driving WirelessHD as a global connectivity standard and to delivering “standards plus” products supporting both wireless and wired HD connectivity standards.”
SiBEAM’s wireless technology has the ability to deliver true uncompressed, lossless high-definition digital video for a broad range of consumer electronics and personal computer applications. The company’s 60GHz Radio Frequency (RF) technology with multi-gigabit data rates offers the highest throughput of any mass market wireless solution available today and is compliant with both the WirelessHD and WiGig standards.
“Silicon Image's market leadership in developing and scaling consumer and PC solutions will help accelerate the growth of SiBEAM's 60GHz products,” said John LeMoncheck, president and chief executive officer at SiBEAM, Inc. "Increasingly, CE, PC, and mobile device manufacturers are looking towards 60GHz solutions for high-speed A/V and data connectivity. The combination of SiBEAM's wireless technology with Silicon Image's strength in HD connectivity solutions for mobile and consumer platforms makes this acquisition a natural fit for both companies.”
Consistent with its “standards plus” strategy, Silicon Image plans to continue to promote and actively engage with the WirelessHD Consortium and the WiGiG Alliance to further advance standards development for 60GHz wireless connectivity.
Until the deal closes, SiBEAM will continue independent operations.
The purchase price of the acquisition will be $25.5 million in cash and Silicon Image stock. The proposed transaction is expected to close in the second quarter of 2011. For 2011, the acquisition is anticipated to be dilutive to Silicon Image’s non-GAAP earnings by approximately $0.06 - $0.08 and neutral to earnings for 2012. The company intends to finalize its estimates of the transaction’s financial impact as well as the accounting for the transaction upon deal close.
“The acquisition of SiBEAM underscores our stated mission to be the leader in advanced video connectivity solutions and SiBEAM’s 60GHz wireless technology will enable us to rapidly bring the highest quality of wirelessly transmitted HD video and audio to market,” said Camillo Martino, chief executive officer of Silicon Image, Inc. “Silicon Image has a proven history of establishing successful global connectivity standards, including DVI®, HDMI®, and most recently MHL™ and we are looking forward to driving WirelessHD as a global connectivity standard and to delivering “standards plus” products supporting both wireless and wired HD connectivity standards.”
SiBEAM’s wireless technology has the ability to deliver true uncompressed, lossless high-definition digital video for a broad range of consumer electronics and personal computer applications. The company’s 60GHz Radio Frequency (RF) technology with multi-gigabit data rates offers the highest throughput of any mass market wireless solution available today and is compliant with both the WirelessHD and WiGig standards.
“Silicon Image's market leadership in developing and scaling consumer and PC solutions will help accelerate the growth of SiBEAM's 60GHz products,” said John LeMoncheck, president and chief executive officer at SiBEAM, Inc. "Increasingly, CE, PC, and mobile device manufacturers are looking towards 60GHz solutions for high-speed A/V and data connectivity. The combination of SiBEAM's wireless technology with Silicon Image's strength in HD connectivity solutions for mobile and consumer platforms makes this acquisition a natural fit for both companies.”
Consistent with its “standards plus” strategy, Silicon Image plans to continue to promote and actively engage with the WirelessHD Consortium and the WiGiG Alliance to further advance standards development for 60GHz wireless connectivity.
Until the deal closes, SiBEAM will continue independent operations.
Tuesday, April 12, 2011
Microsemi to Acquire AML Communications
IRVINE, Calif., April 12, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a smart, secure, connected world, announced today that it has signed a definitive agreement to acquire AML Communications, Inc. (OTCBB:AMLJ) for $2.50 per share in an all-cash transaction. The total transaction value would be approximately $28 million, net of AML Communications' projected cash balance at closing. The transaction is subject to customary closing conditions, including the approval of AML Communications' shareholders, and is expected to close around the end of June, 2011.
AML Communications had previously entered into a definitive merger agreement with Anaren, Inc. (Nasdaq:ANEN) on February 14, 2011 whereby Anaren would acquire AML for $2.15 per share in an all-cash transaction. On April 5, 2011, AML Communications' Board of Directors determined that Microsemi's proposal to acquire AML represented a superior offer to its shareholders.
Headquartered in Camarillo, CA, AML Communications is a leading provider of microwave amplifiers and subsystems for defense electronics applications. The Company has a broad product portfolio and is a key supplier to major defense programs with Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others.
James J. Peterson, Microsemi President and Chief Executive Officer stated, "We are pleased to move forward. The acquisition of AML Communications will add scale and complementary technology to Microsemi's fast-growing RF component and subsystems product offering, enabling us to deliver ever more advanced RF solutions to our customers."
"We are looking forward to joining the Microsemi family," said Jacob Inbar, Chairman, President and CEO of AML. "Our RF microwave technology is extremely complementary to Microsemi's existing product portfolio, and we look forward to leveraging our combined position as a top supplier into leading defense programs."
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.
About AML Communications, Inc.
AML Communications is a designer, manufacturer, and marketer of microelectronic assemblies for the defense industry. Its key customers include Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others. The Company's extensive range of microwave products can be found in leading defense projects. For more information, visit http://www.amlj.com.
AML Communications had previously entered into a definitive merger agreement with Anaren, Inc. (Nasdaq:ANEN) on February 14, 2011 whereby Anaren would acquire AML for $2.15 per share in an all-cash transaction. On April 5, 2011, AML Communications' Board of Directors determined that Microsemi's proposal to acquire AML represented a superior offer to its shareholders.
Headquartered in Camarillo, CA, AML Communications is a leading provider of microwave amplifiers and subsystems for defense electronics applications. The Company has a broad product portfolio and is a key supplier to major defense programs with Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others.
James J. Peterson, Microsemi President and Chief Executive Officer stated, "We are pleased to move forward. The acquisition of AML Communications will add scale and complementary technology to Microsemi's fast-growing RF component and subsystems product offering, enabling us to deliver ever more advanced RF solutions to our customers."
"We are looking forward to joining the Microsemi family," said Jacob Inbar, Chairman, President and CEO of AML. "Our RF microwave technology is extremely complementary to Microsemi's existing product portfolio, and we look forward to leveraging our combined position as a top supplier into leading defense programs."
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.
About AML Communications, Inc.
AML Communications is a designer, manufacturer, and marketer of microelectronic assemblies for the defense industry. Its key customers include Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others. The Company's extensive range of microwave products can be found in leading defense projects. For more information, visit http://www.amlj.com.
Thursday, April 7, 2011
Advanced Analogic and Linear Technology settle
From today's SEC 8K filing from Advanced Analogic: On April 7, 2011, Advanced Analogic Technologies Incorporated issued a press release announcing that on March 31, 2011 it entered into a settlement agreement with Linear Technology Corporation that will end the litigation between the two companies and settle an enforcement proceeding in the United States Court of Appeals for the Federal Circuit entitled Advanced Analogic Technologies, Inc. v. International Trade Commission , Case No. 2010-1543 and an action in the United States District Court for the Northern District of California entitled Advanced Analogic Technologies, Inc. v. Linear Technology Corp. , Case No. C06-0735 (N.D. Cal.). Terms of the settlement were not disclosed.
Gennum Acquires Nanotech Semiconductor
Burlington, Ontario and Bristol, United Kingdom – April 6, 2011 – Gennum Corporation (TSX: GND) announced today it has acquired Nanotech Semiconductor Limited, a leading fabless IC company specializing in advanced CMOS mixed-signal ICs for fiber optic communications. This acquisition, pursuant to which Gennum paid USD$34 million in cash and agreed to an earn-out as described below, further strengthens Gennum's growth strategy in the optical transceiver IC market by adding state-of-the-art CMOS products and technology for high volume applications such as Ethernet, PON, telecom and consumer optics.
The transaction is expected to result in a number of benefits, including the following:
"Through this acquisition, Gennum has significantly strengthened our mixed-signal and optical product portfolio and added critical CMOS technology capability enabling our company to address a broader range of high growth networking markets such as Fiber to the Home, Ethernet and consumer optics," said Dr. Franz Fink, President and Chief Executive Officer of Gennum. "We have listened to our customers' needs to simplify the supply chain and can now provide them with one of the most complete optical transceiver ICs portfolios spanning all data rates. Indeed, we believe the Nanotech portfolio coupled with Gennum's high speed mixed signal and optical portfolio will increase our ability to provide more, high value products resulting in increased growth opportunities for Gennum."
"We are excited to join Gennum and create one of the industry's most compelling optical IC transceiver portfolios," said Gary Steele, Founder, CEO and Chairman of the Board of Nanotech. "By integrating our recognized expertise in low cost, high performance CMOS based optical products and technologies and talented employees with Gennum's high speed optical products and global organization, customers will gain access to a uniquely comprehensive portfolio and product roadmap."
Expansion of Optical Transceiver Portfolio to Accelerate Growth Strategy
Gennum expects the combined portfolio will deliver highly differentiated optical products that capture a greater portion of the silicon content in applications such as telecommunications, networking, fiber to the home, and consumer connectivity.
The transaction is expected to result in a number of benefits, including the following:
- Increased market presence in an expanded, US$1.3 billion addressable market
- A strongly positioned business with a highly differentiated optical transceiver IC portfolio, spanning the entire optical speed range from 100Mb/s to 100Gb/s
- Strengthened optical transceiver IC market position for telecom, Ethernet, PON and consumer optics applications
- State of the art CMOS technology to deliver groundbreaking low cost optical IC products
- Addresses customers' need to consolidate the supply chain and provide a convenient one-stop-shop for optical transceiver ICs at all data rates
- Increased revenues, with Nanotech's revenues for the year ended December 31, 2010 being approximately US$7.4 million and current revenues being approximately US$1.0 million per month
"Through this acquisition, Gennum has significantly strengthened our mixed-signal and optical product portfolio and added critical CMOS technology capability enabling our company to address a broader range of high growth networking markets such as Fiber to the Home, Ethernet and consumer optics," said Dr. Franz Fink, President and Chief Executive Officer of Gennum. "We have listened to our customers' needs to simplify the supply chain and can now provide them with one of the most complete optical transceiver ICs portfolios spanning all data rates. Indeed, we believe the Nanotech portfolio coupled with Gennum's high speed mixed signal and optical portfolio will increase our ability to provide more, high value products resulting in increased growth opportunities for Gennum."
"We are excited to join Gennum and create one of the industry's most compelling optical IC transceiver portfolios," said Gary Steele, Founder, CEO and Chairman of the Board of Nanotech. "By integrating our recognized expertise in low cost, high performance CMOS based optical products and technologies and talented employees with Gennum's high speed optical products and global organization, customers will gain access to a uniquely comprehensive portfolio and product roadmap."
Expansion of Optical Transceiver Portfolio to Accelerate Growth Strategy
Gennum expects the combined portfolio will deliver highly differentiated optical products that capture a greater portion of the silicon content in applications such as telecommunications, networking, fiber to the home, and consumer connectivity.
The Nanotech portfolio includes industry-leading CMOS based optical ICs. These products span the following optical markets:
- OC-3, OC-12, Gigabit Ethernet based telecommunications applications
- GEPON, GPON for fiber to the home applications
- Fast Ethernet, Gigabit Ethernet based networking applications
- Firewire, Fast Ethernet, Gigabit Ethernet, HDMI for consumer applications
Transaction Summary Under the transaction, Gennum acquired all of the outstanding shares of Nanotech at a purchase price of US$34 million plus an amount of up to US$6 million payable under an earn-out for the achievement by Nanotech of revenue targets over the next 12 months between US$10 million and US$14 million. Based on information provided by Nanotech, Gennum expects that the transaction will be accretive on a non-GAAP* basis and approximately neutral to its GAAP earnings in the fiscal year ending November 30, 2011. Gennum expects the transaction to be accretive to its GAAP earnings in fiscal 2012.
About Gennum
Gennum Corporation (TSX: GND) designs innovative semiconductor solutions and intellectual property (IP) cores to serve the rising global demand for high-speed data transmission products in the broadcast, networking, storage and telecommunications markets. Gennum offers proven optical, analog and mixed-signal solutions with uncompromising signal integrity to support standards such as high-definition (HD) video, Fibre Channel, InfiniBand®, Ethernet, SONET and PCI Express®. The company is headquartered in Burlington, Canada, and has global design, research and development and sales offices in Canada, Mexico, Japan, Germany, United States, India and the United Kingdom. www.gennum.com.
About Nanotech
Based in the United Kingdom, Nanotech is a fabless chip company, focused on analog and mixed-signal ICs principally for fiber-optics based communications.
Wednesday, April 6, 2011
Microsemi makes bid for AML Communications
IRVINE, Calif., April 6, 2011 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a smart, secure, connected world, announced today that it has submitted a proposal to acquire AML Communications, Inc. (OTCBB:AMLJ) for $2.50 per share in an all-cash transaction. The total transaction value would be approximately $28 million, net of AML Communications' projected cash balance at closing.
AML Communications had previously entered into a definitive merger agreement with Anaren, Inc. on February 14, 2011 whereby Anaren would acquire all of AML's outstanding shares of common stock for $2.15 per share in an all-cash transaction. Microsemi's acquisition proposal represents a 16% premium to the offer made by Anaren and has been deemed a superior offer by AML Communications' Board of Directors. As a result, AML Communications' Board of Directors has delivered a notice to Anaren of its intent to withdraw its recommendation of the current Anaren transaction to the AML Communications stockholders.
Headquartered in Camarillo, CA, AML Communications is a leading provider of microwave amplifiers and subsystems for defense electronics applications. The Company has a broad product portfolio and is a key supplier to major defense programs with Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others.
James J. Peterson, Microsemi President and Chief Executive Officer stated, "RF components are increasingly important in today's defense programs and Unmanned Aerial Vehicle (UAV) systems. The acquisition of AML Communications would add scale and complementary technology to Microsemi's fast-growing RF component and subsystems product offering, enabling us to deliver ever more advanced RF solutions to our customers. Additionally, we expect this transaction would be immediately accretive to Microsemi earnings."
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.
About AML Communications, Inc.
AML Communications is a designer, manufacturer, and marketer of microelectronic assemblies for the defense industry. Its key customers include Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others. The Company's extensive range of microwave products can be found in leading defense projects. For more information, visit http://www.amlj.com.
AML Communications had previously entered into a definitive merger agreement with Anaren, Inc. on February 14, 2011 whereby Anaren would acquire all of AML's outstanding shares of common stock for $2.15 per share in an all-cash transaction. Microsemi's acquisition proposal represents a 16% premium to the offer made by Anaren and has been deemed a superior offer by AML Communications' Board of Directors. As a result, AML Communications' Board of Directors has delivered a notice to Anaren of its intent to withdraw its recommendation of the current Anaren transaction to the AML Communications stockholders.
Headquartered in Camarillo, CA, AML Communications is a leading provider of microwave amplifiers and subsystems for defense electronics applications. The Company has a broad product portfolio and is a key supplier to major defense programs with Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others.
James J. Peterson, Microsemi President and Chief Executive Officer stated, "RF components are increasingly important in today's defense programs and Unmanned Aerial Vehicle (UAV) systems. The acquisition of AML Communications would add scale and complementary technology to Microsemi's fast-growing RF component and subsystems product offering, enabling us to deliver ever more advanced RF solutions to our customers. Additionally, we expect this transaction would be immediately accretive to Microsemi earnings."
About Microsemi
Microsemi Corporation (Nasdaq:MSCC) offers the industry's most comprehensive portfolio of semiconductor technology. Committed to solving the most critical system challenges, Microsemi's products include high-performance, high-reliability analog and RF devices, mixed signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems. Microsemi serves leading system manufacturers around the world in the defense, security, aerospace, enterprise, commercial, and industrial markets. Learn more at http://www.microsemi.com.
About AML Communications, Inc.
AML Communications is a designer, manufacturer, and marketer of microelectronic assemblies for the defense industry. Its key customers include Raytheon, Lockheed Martin, Northrop Grumman, L-3 Communications, BAE, and others. The Company's extensive range of microwave products can be found in leading defense projects. For more information, visit http://www.amlj.com.
Monday, April 4, 2011
TI to acquire National Semiconductor
DALLAS, TEXAS and SANTA CLARA, CALIF. — Texas Instruments Incorporated (TI) (NYSE: TXN) and National Semiconductor (NYSE: NSM) today announced they have signed a definitive agreement under which TI will acquire National for $25 per share in an all-cash transaction of about $6.5 billion. The acquisition combines two industry leaders in analog semiconductors, each with unique strengths in delivering products to improve performance and efficiency and convert real-world signals in electronic systems. The boards of directors of both companies have unanimously approved the transaction.
“This acquisition is about strength and growth,” said Rich Templeton, TI’s chairman, president and chief executive officer. “National has an excellent development team, and its products combined with our own can offer customers an analog portfolio of unmatched depth and breadth. In recent years, National’s management team has done an outstanding job of improving margins and streamlining expenses, which upon close will increase TI’s profitability and earnings per share, excluding transaction costs. Our ability to accelerate National’s growth with our much larger sales force is the foundation of our belief that we can produce strong returns on our investment. The combined sales team will be 10 times larger than National’s is today, and the portfolio will be exposed to more customers in more markets.”
“Our two companies complement each other very well,” said Don Macleod, National’s chief executive officer. “TI has much greater scale in the marketplace, with its larger portfolio of products and its large global sales force. This provides a platform to enhance National’s strong and highly profitable analog capability, power management in particular, leading to meaningful growth.”
Each company has unique strengths. Among them are the breadth of TI’s 30,000 analog products, extensive customer reach, and industry-leading manufacturing including the world’s first 300-millimeter analog factory. National brings a portfolio of 12,000 analog products, a strong position with customers in the industrial power market, and excellent customer design tools. Upon close of the transaction, National becomes part of TI’s analog segment, and sales of analog semiconductors will represent almost 50 percent of TI’s revenue.
The combined company also will benefit from National’s manufacturing operations, located in Maine, Scotland and Malaysia, which TI will continue to operate. Each site has additional capacity to increase production. National’s headquarters will remain in Santa Clara, California.
Under terms of the agreement, National stockholders will receive $25 in cash for each share of National common stock they hold at the time of closing. TI expects to fund the transaction with a combination of existing cash balances and debt. The acquisition is subject to customary closing conditions, including review by U.S. and international regulators and approval by National’s shareholders. The transaction is expected to close in six to nine months.
The market for analog semiconductors was $42 billion in 2010. TI is the market leader with 2010 analog revenue of $6.0 billion, or 14 percent of the market. National’s revenue in calendar year 2010 was about $1.6 billion, or 3 percent of the market.
“Our two companies complement each other very well,” said Don Macleod, National’s chief executive officer. “TI has much greater scale in the marketplace, with its larger portfolio of products and its large global sales force. This provides a platform to enhance National’s strong and highly profitable analog capability, power management in particular, leading to meaningful growth.”
Each company has unique strengths. Among them are the breadth of TI’s 30,000 analog products, extensive customer reach, and industry-leading manufacturing including the world’s first 300-millimeter analog factory. National brings a portfolio of 12,000 analog products, a strong position with customers in the industrial power market, and excellent customer design tools. Upon close of the transaction, National becomes part of TI’s analog segment, and sales of analog semiconductors will represent almost 50 percent of TI’s revenue.
The combined company also will benefit from National’s manufacturing operations, located in Maine, Scotland and Malaysia, which TI will continue to operate. Each site has additional capacity to increase production. National’s headquarters will remain in Santa Clara, California.
Under terms of the agreement, National stockholders will receive $25 in cash for each share of National common stock they hold at the time of closing. TI expects to fund the transaction with a combination of existing cash balances and debt. The acquisition is subject to customary closing conditions, including review by U.S. and international regulators and approval by National’s shareholders. The transaction is expected to close in six to nine months.
The market for analog semiconductors was $42 billion in 2010. TI is the market leader with 2010 analog revenue of $6.0 billion, or 14 percent of the market. National’s revenue in calendar year 2010 was about $1.6 billion, or 3 percent of the market.
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